Part Details for CS16LV20483HIP55 by Chiplus Semiconductor Corp
Overview of CS16LV20483HIP55 by Chiplus Semiconductor Corp
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for CS16LV20483HIP55
Part # | Distributor | Description | Stock | Price | Buy | |
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ComSIT USA | 128K WORD X 16 BIT HIGH SPEED SUPER LOW POWER SRAM Standard SRAM, 128KX16, 55ns, CMOS, PBGA48 RoHS: Not Compliant | Europe - 450 |
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RFQ |
Part Details for CS16LV20483HIP55
CS16LV20483HIP55 CAD Models
CS16LV20483HIP55 Part Data Attributes:
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CS16LV20483HIP55
Chiplus Semiconductor Corp
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Datasheet
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CS16LV20483HIP55
Chiplus Semiconductor Corp
Standard SRAM, 128KX16, 55ns, CMOS, PBGA48, MINIBGA-48
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Rohs Code | Yes | |
Part Life Cycle Code | Contact Manufacturer | |
Ihs Manufacturer | CHIPLUS SEMICONDUCTOR CORP | |
Package Description | TFBGA, BGA48,6X8,30 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 55 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B48 | |
Length | 8 mm | |
Memory Density | 2097152 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 16 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 48 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 128KX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA48,6X8,30 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 250 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Standby Current-Max | 0.000002 A | |
Standby Voltage-Min | 1.5 V | |
Supply Current-Max | 0.025 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.75 mm | |
Terminal Position | BOTTOM | |
Width | 6 mm |