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Microprocessor Circuit, CMOS, 4 X 4 MM, ROHS COMPLIANT, MO-220-WGGD, QFN-24
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Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
74AC8665
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Newark | Usb To Spi Bridge, -40 To 85Deg C, Bridge Type:Usb To Spi, Supply Voltage Min:3V, Supply Voltage Max:3.6V, Interface Case Style:Qfn, No. Of Pins:24Pins, Operating Temperature Min:-40°C, Operating Temperature Max:85°C, Product Rohs Compliant: Yes |Silicon Labs CP2130-F01-GM Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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Buy Now | |
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NexGen Digital | 2 |
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RFQ | ||
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Chip1Cloud | IC USB TO SPI BRIDGE 24QFN | 1150 |
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RFQ |
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CP2130-F01-GM
Silicon Laboratories Inc
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Datasheet
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CP2130-F01-GM
Silicon Laboratories Inc
Microprocessor Circuit, CMOS, 4 X 4 MM, ROHS COMPLIANT, MO-220-WGGD, QFN-24
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SILICON LABORATORIES INC | |
Package Description | HVQCCN, | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Silicon Labs | |
JESD-30 Code | S-XQCC-N24 | |
Length | 4 mm | |
Number of Terminals | 24 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | HVQCCN | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 0.8 mm | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 4 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |