Datasheets
CP2130-F01-GM by:

Microprocessor Circuit, CMOS, 4 X 4 MM, ROHS COMPLIANT, MO-220-WGGD, QFN-24

Part Details for CP2130-F01-GM by Silicon Laboratories Inc

Overview of CP2130-F01-GM by Silicon Laboratories Inc

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Price & Stock for CP2130-F01-GM

Part # Distributor Description Stock Price Buy
DISTI # 74AC8665
Newark Usb To Spi Bridge, -40 To 85Deg C, Bridge Type:Usb To Spi, Supply Voltage Min:3V, Supply Voltage Max:3.6V, Interface Case Style:Qfn, No. Of Pins:24Pins, Operating Temperature Min:-40°C, Operating Temperature Max:85°C, Product Rohs Compliant: Yes |Silicon Labs CP2130-F01-GM Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk 0
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Chip1Cloud IC USB TO SPI BRIDGE 24QFN 1150
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Part Details for CP2130-F01-GM

CP2130-F01-GM CAD Models

CP2130-F01-GM Part Data Attributes

CP2130-F01-GM Silicon Laboratories Inc
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CP2130-F01-GM Silicon Laboratories Inc Microprocessor Circuit, CMOS, 4 X 4 MM, ROHS COMPLIANT, MO-220-WGGD, QFN-24
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SILICON LABORATORIES INC
Package Description HVQCCN,
Reach Compliance Code compliant
HTS Code 8542.31.00.01
Samacsys Manufacturer Silicon Labs
JESD-30 Code S-XQCC-N24
Length 4 mm
Number of Terminals 24
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Code HVQCCN
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 0.8 mm
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form NO LEAD
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT

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