Part Details for COM20022I by Microchip Technology Inc
Overview of COM20022I by Microchip Technology Inc
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Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
Part Details for COM20022I
COM20022I CAD Models
COM20022I Part Data Attributes
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COM20022I
Microchip Technology Inc
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COM20022I
Microchip Technology Inc
IC,LAN NODE CONTROLLER,CMOS,QFP,48PIN
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | TQFP-48 | |
| Reach Compliance Code | compliant | |
| Address Bus Width | 3 | |
| Boundary Scan | NO | |
| Bus Compatibility | 8051; 6801 | |
| Clock Frequency-Max | 20 MHz | |
| Communication Protocol | ASYNC, BIT; SYNC, BYTE | |
| Data Encoding/Decoding Method | NRZ | |
| Data Transfer Rate-Max | 1.25 MBps | |
| External Data Bus Width | 16 | |
| JESD-30 Code | S-PQFP-G48 | |
| JESD-609 Code | e0 | |
| Length | 7 mm | |
| Low Power Mode | NO | |
| Number of Serial I/Os | 1 | |
| Number of Terminals | 48 | |
| On Chip Data RAM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP48,.35SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 235 | |
| Qualification Status | Not Qualified | |
| RAM (words) | 2048 | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 7 mm | |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, LAN |