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Part Details for CMX7032Q1 by CML Microcircuits Plc
Results Overview of CMX7032Q1 by CML Microcircuits Plc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
CMX7032Q1 Information
CMX7032Q1 by CML Microcircuits Plc is a Modem.
Modems are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for CMX7032Q1
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2032-1003-ND
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DigiKey | AIS BASEBAND PROCESSOR W/RF SYNT Min Qty: 30 Lead time: 20 Weeks Container: Tray | Temporarily Out of Stock |
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$22.2000 | Buy Now |
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DISTI #
226-CMX7032Q1
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Mouser Electronics | RF Wireless Misc AIS Class-A/B and exacTrax Enabled RoHS: Compliant | 0 |
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$19.9600 / $22.9500 | Order Now |
Part Details for CMX7032Q1
CMX7032Q1 CAD Models
CMX7032Q1 Part Data Attributes
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CMX7032Q1
CML Microcircuits Plc
Buy Now
Datasheet
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Compare Parts:
CMX7032Q1
CML Microcircuits Plc
Modem, VQFN-64
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | CML MICROCIRCUITS LTD | |
| Part Package Code | QFN | |
| Package Description | VQFN-64 | |
| Pin Count | 64 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | CML Micro | |
| Data Rate | 9 Mbps | |
| JESD-30 Code | S-XQCC-N64 | |
| Length | 9 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 64 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Telecom IC Type | MODEM | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 9 mm |
CMX7032Q1 Frequently Asked Questions (FAQ)
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The recommended PCB layout involves keeping the analog and digital grounds separate, using a solid ground plane, and placing decoupling capacitors close to the device. For thermal management, ensure good airflow, use a heat sink if necessary, and follow the recommended thermal pad connection.
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To optimize for low power consumption, use the power-down mode, reduce the clock frequency, minimize the use of external components, and optimize the transmit power level. Additionally, consider using a low-power oscillator and reducing the voltage supply.
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To minimize EMI and RFI, use a shielded enclosure, keep the device away from antennas and other RF sources, and ensure good grounding and bonding of the PCB and enclosure. Additionally, use EMI filters and shielding materials as necessary.
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To troubleshoot common issues, use a logic analyzer or oscilloscope to monitor the device's signals, check the power supply and clock signals, and verify the configuration and programming of the device. Consult the datasheet and application notes for specific troubleshooting guidelines.
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To operate the device in harsh environments, ensure the device is properly packaged and sealed, use a temperature range-compatible oscillator, and follow the recommended operating conditions. Additionally, consider using conformal coating, potting, or other environmental protection methods.