Part Details for CLC501AWG-MLS by National Semiconductor Corporation
Overview of CLC501AWG-MLS by National Semiconductor Corporation
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Part Details for CLC501AWG-MLS
CLC501AWG-MLS CAD Models
CLC501AWG-MLS Part Data Attributes:
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CLC501AWG-MLS
National Semiconductor Corporation
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CLC501AWG-MLS
National Semiconductor Corporation
IC OP-AMP, 5000 uV OFFSET-MAX, CDSO10, CERAMIC, SOIC-10, Operational Amplifier
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
| Part Package Code | SOIC | |
| Package Description | SOP, SOP10,.45 | |
| Pin Count | 10 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Amplifier Type | OPERATIONAL AMPLIFIER | |
| Architecture | CURRENT-FEEDBACK | |
| Bias Current-Max (IIB) @25C | 30 µA | |
| Common-mode Reject Ratio-Nom | 60 dB | |
| Frequency Compensation | YES | |
| Input Offset Voltage-Max | 5000 µV | |
| JESD-30 Code | R-GDSO-G10 | |
| JESD-609 Code | e0 | |
| Low-Offset | NO | |
| Neg Supply Voltage Limit-Max | -7 V | |
| Neg Supply Voltage-Nom (Vsup) | -5 V | |
| Number of Functions | 1 | |
| Number of Terminals | 10 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | SOP | |
| Package Equivalence Code | SOP10,.45 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Seated Height-Max | 2.33 mm | |
| Slew Rate-Min | 700 V/us | |
| Supply Current-Max | 25 mA | |
| Supply Voltage Limit-Max | 7 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | BIPOLAR | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Wideband | YES | |
| Width | 6.12 mm |