Datasheets
CL1I-67204L-55 by:

FIFO, 4KX9, 55ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28

Part Details for CL1I-67204L-55 by Temic Semiconductors

Overview of CL1I-67204L-55 by Temic Semiconductors

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Applications Education and Research Internet of Things (IoT) Industrial Automation Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Electronic Manufacturing Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
75867-204LF Amphenol Communications Solutions Quickie®, Wire to Board Connector, Double Row, 20 Positions, 2.54 mm (0.100in), Right Angle, Shrouded Header 3.81 um (150 u\\.) Tin-Lead Plating

Part Details for CL1I-67204L-55

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CL1I-67204L-55 Part Data Attributes

CL1I-67204L-55 Temic Semiconductors
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CL1I-67204L-55 Temic Semiconductors FIFO, 4KX9, 55ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28
Part Life Cycle Code Transferred
Ihs Manufacturer TEMIC SEMICONDUCTORS
Package Description 0.600 INCH, CERAMIC, DIP-28
Reach Compliance Code unknown
Access Time-Max 55 ns
Cycle Time 70 ns
JESD-30 Code R-GDIP-T28
Memory Density 36864 bit
Memory Width 9
Number of Functions 1
Number of Terminals 28
Number of Words 4096 words
Number of Words Code 4000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 4KX9
Output Enable NO
Package Body Material CERAMIC, GLASS-SEALED
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Position DUAL

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