Part Details for CL1I-67204L-55 by Temic Semiconductors
Overview of CL1I-67204L-55 by Temic Semiconductors
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Electronic Manufacturing
Automotive
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
75867-204LF | Amphenol Communications Solutions | Quickie®, Wire to Board Connector, Double Row, 20 Positions, 2.54 mm (0.100in), Right Angle, Shrouded Header 3.81 um (150 u\\.) Tin-Lead Plating |
Part Details for CL1I-67204L-55
CL1I-67204L-55 CAD Models
CL1I-67204L-55 Part Data Attributes
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CL1I-67204L-55
Temic Semiconductors
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Datasheet
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CL1I-67204L-55
Temic Semiconductors
FIFO, 4KX9, 55ns, Asynchronous, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28
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Part Life Cycle Code | Transferred | |
Ihs Manufacturer | TEMIC SEMICONDUCTORS | |
Package Description | 0.600 INCH, CERAMIC, DIP-28 | |
Reach Compliance Code | unknown | |
Access Time-Max | 55 ns | |
Cycle Time | 70 ns | |
JESD-30 Code | R-GDIP-T28 | |
Memory Density | 36864 bit | |
Memory Width | 9 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 4096 words | |
Number of Words Code | 4000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 4KX9 | |
Output Enable | NO | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Position | DUAL |