Part Details for CDRH3D16/HPNP-330MC by Sumida Corporation

The recommended PCB layout involves placing the component on a 2-layer or 4-layer board with a solid ground plane, and using thermal vias to dissipate heat. A thermal pad on the bottom of the component should be connected to a large copper area on the PCB to facilitate heat dissipation.

To ensure reliability in high-temperature environments, it's essential to follow the recommended derating curves, ensure proper thermal management, and avoid exceeding the maximum operating temperature. Additionally, consider using a thermally conductive interface material between the component and the PCB.

To minimize EMI and RFI, use a shielded enclosure, keep the component away from sensitive circuits, and use a common-mode choke or ferrite bead to filter out high-frequency noise. Also, ensure the PCB layout is designed to minimize radiation and coupling.

While the component is designed to withstand some vibration, it's essential to follow the recommended mounting and soldering procedures to ensure the component's reliability in high-vibration environments. Consider using a vibration-dampening material or a shock-absorbing mount to minimize the impact of vibrations.

Handle the component by the body, avoiding touching the pins or electrical connections. Store the component in a dry, cool place, away from direct sunlight and moisture. Avoid bending or flexing the component's leads, and use an anti-static wrist strap or mat when handling the component.