Part Details for CBP-3063(GEA) by ADLINK Technology Inc
Overview of CBP-3063(GEA) by ADLINK Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Not Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
RJP3063DPP-00#T2 | Renesas Electronics Corporation | Insulated-Gate Bipolar Transistors (IGBT) | |
75168-306-36LF | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch. | |
61083-063409LF | Amphenol Communications Solutions | BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 60 Positions. |
Price & Stock for CBP-3063(GEA)
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
CBP-3063(GEA)
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Avnet Americas | Back Plane, PICMG 2.11, 3U CompactPCI, 47-pin power for 3 power modules - Bulk (Alt: CBP-3063(GEA)) RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Lead time: 13 Weeks, 0 Days Container: Bulk | 0 |
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RFQ |