Part Details for C165LF3VHABXUMA1 by Infineon Technologies AG
Overview of C165LF3VHABXUMA1 by Infineon Technologies AG
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Part Details for C165LF3VHABXUMA1
C165LF3VHABXUMA1 CAD Models
C165LF3VHABXUMA1 Part Data Attributes
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C165LF3VHABXUMA1
Infineon Technologies AG
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C165LF3VHABXUMA1
Infineon Technologies AG
Microcontroller, 16-Bit, 20MHz, CMOS, PQFP100, 0.50 MM PITCH, GREEN, PLASTIC, TQFP-100
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | 0.50 MM PITCH, GREEN, PLASTIC, TQFP-100 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Has ADC | NO | |
| Address Bus Width | 24 | |
| Bit Size | 16 | |
| Boundary Scan | NO | |
| Clock Frequency-Max | 40 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | 16 | |
| JESD-30 Code | S-PQFP-G100 | |
| JESD-609 Code | e3 | |
| Length | 14 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 77 | |
| Number of Terminals | 100 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| ROM (words) | 0 | |
| ROM Programmability | ROM LESS | |
| Seated Height-Max | 1.6 mm | |
| Speed | 20 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |