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Zener Diode, 3V V(Z), 6.67%, 0.2W, Silicon, Unidirectional, PLASTIC PACKAGE-2
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
BZT52C3V0S-TP by Micro Commercial Components is a Zener Diode.
Zener Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
BZT52C3V0S-TPMSCT-ND
|
DigiKey | DIODE ZENER 3V 200MW SOD323 Min Qty: 1 Lead time: 20 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
2888 In Stock |
|
$0.0175 / $0.1500 | Buy Now |
DISTI #
833-BZT52C3V0S-TP
|
Mouser Electronics | Zener Diodes 200mW 3V RoHS: Compliant | 2363 |
|
$0.0240 / $0.1500 | Buy Now |
DISTI #
BZT52C3V0S-TP
|
TME | Diode: Zener, 200mW, 3V, SMD, reel,tape, SOD323, single diode, 10uA Min Qty: 25 | 0 |
|
$0.0159 / $0.0324 | RFQ |
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BZT52C3V0S-TP
Micro Commercial Components
Buy Now
Datasheet
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Compare Parts:
BZT52C3V0S-TP
Micro Commercial Components
Zener Diode, 3V V(Z), 6.67%, 0.2W, Silicon, Unidirectional, PLASTIC PACKAGE-2
Select a part to compare: |
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICRO COMMERCIAL COMPONENTS CORP | |
Package Description | PLASTIC PACKAGE-2 | |
Pin Count | 2 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8541.10.00.50 | |
Samacsys Manufacturer | MCC | |
Configuration | SINGLE | |
Diode Element Material | SILICON | |
Diode Type | ZENER DIODE | |
Dynamic Impedance-Max | 95 Ω | |
JESD-30 Code | R-PDSO-F2 | |
JESD-609 Code | e3 | |
Knee Impedance-Max | 600 Ω | |
Moisture Sensitivity Level | 1 | |
Number of Elements | 1 | |
Number of Terminals | 2 | |
Operating Temperature-Max | 150 °C | |
Operating Temperature-Min | -65 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Polarity | UNIDIRECTIONAL | |
Power Dissipation-Max | 0.2 W | |
Qualification Status | Not Qualified | |
Reference Voltage-Nom | 3 V | |
Reverse Current-Max | 0.01 µA | |
Surface Mount | YES | |
Technology | ZENER | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | FLAT | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 10 | |
Voltage Tol-Max | 6.67% | |
Working Test Current | 5 mA |
The recommended land pattern for BZT52C3V0S-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It is essential to follow the recommended land pattern to ensure proper soldering and to prevent thermal and mechanical stress on the component.
While BZT52C3V0S-TP has a maximum operating temperature of 150°C, it's essential to consider the derating curves and thermal management in high-temperature applications. It's recommended to consult with a thermal expert or the manufacturer's application team to ensure the component can operate safely and reliably in the specific environment.
To prevent electrostatic discharge (ESD) damage, it's crucial to follow proper handling and storage procedures. Use ESD-safe materials, such as wrist straps, mats, and bags, and ensure that the workspace is ESD-protected. Additionally, consider adding ESD protection components, such as TVS diodes, in the circuit design.
The recommended soldering profile for BZT52C3V0S-TP can be found in the Micro Commercial Components' application note or in the IPC-J-STD-020 standard. A typical profile includes a peak temperature of 240°C to 250°C, with a dwell time of 30 seconds to 60 seconds. It's essential to follow the recommended profile to prevent thermal damage and ensure reliable solder joints.
While BZT52C3V0S-TP is a robust component, it's essential to consider the vibration specifications and ensure that the component is properly secured to the PCB. Consult with a mechanical engineer or the manufacturer's application team to ensure the component can operate safely and reliably in the specific vibration environment.