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Part Details for BZT52B3V0JS-TP by Micro Commercial Components
Results Overview of BZT52B3V0JS-TP by Micro Commercial Components
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Environmental Monitoring
Audio and Video Systems
Aerospace and Defense
Energy and Power Systems
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Renewable Energy
Electronic Manufacturing
Automotive
BZT52B3V0JS-TP Information
BZT52B3V0JS-TP by Micro Commercial Components is a Zener Diode.
Zener Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Price & Stock for BZT52B3V0JS-TP
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
BZT52B3V0JS-TP-ND
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DigiKey | DIODE ZENER 3V 200MW SOD323 Min Qty: 3000 Lead time: 20 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$0.0313 / $0.0510 | Buy Now |
|
DISTI #
833-BZT52B3V0JS-TP
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Mouser Electronics | Zener Diodes 200mW 0.9Vf 2.94Vz 1.0Vr 9.0uA RoHS: Compliant | 3000 |
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$0.0310 / $0.3300 | Buy Now |
Part Details for BZT52B3V0JS-TP
BZT52B3V0JS-TP CAD Models
BZT52B3V0JS-TP Part Data Attributes
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BZT52B3V0JS-TP
Micro Commercial Components
Buy Now
Datasheet
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Compare Parts:
BZT52B3V0JS-TP
Micro Commercial Components
Zener Diode,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICRO COMMERCIAL COMPONENTS CORP | |
| Package Description | R-PDSO-G2 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.50 | |
| Samacsys Manufacturer | MCC | |
| Configuration | SINGLE | |
| Diode Element Material | SILICON | |
| Diode Type | ZENER DIODE | |
| Dynamic Impedance-Max | 89 Ω | |
| JESD-30 Code | R-PDSO-G2 | |
| JESD-609 Code | e3 | |
| Knee Impedance-Max | 564 Ω | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity | UNIDIRECTIONAL | |
| Power Dissipation-Max | 0.2 W | |
| Reference Voltage-Nom | 3 V | |
| Reverse Current-Max | 0.009 µA | |
| Surface Mount | YES | |
| Technology | ZENER | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Voltage Tol-Max | 2% | |
| Working Test Current | 5 mA |
BZT52B3V0JS-TP Frequently Asked Questions (FAQ)
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The recommended land pattern for BZT52B3V0JS-TP can be found in the Micro Commercial Components' packaging information document or in the IPC-7351 standard. It is essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal and mechanical stress on the component.
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BZT52B3V0JS-TP is a static-sensitive device. To handle it safely, use anti-static wrist straps, mats, or bags to prevent electrostatic discharge (ESD) damage. Ensure that the workspace and tools are also ESD-safe.
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The maximum storage temperature for BZT52B3V0JS-TP is typically 40°C (104°F) with a relative humidity of 90% or less. Storing the component beyond this temperature range may affect its reliability and lifespan.
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Yes, BZT52B3V0JS-TP is suitable for high-reliability applications. However, it is essential to follow the recommended operating conditions, storage guidelines, and handling procedures to ensure the component's reliability and performance.
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Use a soldering iron with a temperature of 250°C (482°F) or less, and a solder with a melting point of 180°C (356°F) or higher. Apply a small amount of solder to the component leads, and avoid applying excessive heat or force, which can damage the component.