Part Details for BYM26B by NXP Semiconductors
Overview of BYM26B by NXP Semiconductors
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Aerospace and Defense
Energy and Power Systems
Part Details for BYM26B
BYM26B CAD Models
BYM26B Part Data Attributes
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BYM26B
NXP Semiconductors
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Datasheet
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BYM26B
NXP Semiconductors
1.05A, 400V, SILICON, RECTIFIER DIODE, HERMETIC SEALED, GLASS PACKAGE-2
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | HERMETIC SEALED, GLASS PACKAGE-2 | |
| Pin Count | 2 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Application | FAST SOFT RECOVERY | |
| Case Connection | ISOLATED | |
| Configuration | SINGLE | |
| Diode Element Material | SILICON | |
| Diode Type | RECTIFIER DIODE | |
| Forward Voltage-Max (VF) | 2.65 V | |
| JESD-30 Code | O-LALF-W2 | |
| Moisture Sensitivity Level | 1 | |
| Non-rep Pk Forward Current-Max | 45 A | |
| Number of Elements | 1 | |
| Number of Phases | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 175 °C | |
| Output Current-Max | 1.05 A | |
| Package Body Material | GLASS | |
| Package Shape | ROUND | |
| Package Style | LONG FORM | |
| Qualification Status | Not Qualified | |
| Rep Pk Reverse Voltage-Max | 400 V | |
| Reverse Current-Max | 10 µA | |
| Reverse Recovery Time-Max | 0.03 µs | |
| Surface Mount | NO | |
| Technology | AVALANCHE | |
| Terminal Form | WIRE | |
| Terminal Position | AXIAL |