Part Details for BUK9MLL-55PLL by NXP Semiconductors
Overview of BUK9MLL-55PLL by NXP Semiconductors
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Part Details for BUK9MLL-55PLL
BUK9MLL-55PLL CAD Models
BUK9MLL-55PLL Part Data Attributes:
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BUK9MLL-55PLL
NXP Semiconductors
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Datasheet
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BUK9MLL-55PLL
NXP Semiconductors
TRANSISTOR 5900 mA, 55 V, 2 CHANNEL, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, MS-013AC, PLASTIC, SOP-20, FET General Purpose Small Signal
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | SOIC | |
Package Description | PLASTIC, SOP-20 | |
Pin Count | 20 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
Case Connection | ISOLATED | |
Configuration | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE | |
DS Breakdown Voltage-Min | 55 V | |
Drain Current-Max (ID) | 5.9 A | |
Drain-source On Resistance-Max | 0.0558 Ω | |
FET Technology | METAL-OXIDE SEMICONDUCTOR | |
Feedback Cap-Max (Crss) | 82 pF | |
JEDEC-95 Code | MS-013AC | |
JESD-30 Code | R-PDSO-G20 | |
Moisture Sensitivity Level | 3 | |
Number of Elements | 2 | |
Number of Terminals | 20 | |
Operating Mode | ENHANCEMENT MODE | |
Operating Temperature-Max | 150 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Polarity/Channel Type | N-CHANNEL | |
Power Dissipation-Max (Abs) | 3.3 W | |
Qualification Status | Not Qualified | |
Surface Mount | YES | |
Terminal Form | GULL WING | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Transistor Application | SWITCHING | |
Transistor Element Material | SILICON |