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BUK9535-100A,127 by:
NXP Semiconductors
Nexperia
NXP Semiconductors
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N-channel TrenchMOS logic level FET TO-220 3-Pin

Part Details for BUK9535-100A,127 by NXP Semiconductors

Results Overview of BUK9535-100A,127 by NXP Semiconductors

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BUK9535-100A,127 Information

BUK9535-100A,127 by NXP Semiconductors is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for BUK9535-100A,127

Part # Distributor Description Stock Price Buy
Rochester Electronics 41A, 100V, 0.039ohm, N-Channel Power MOSFET, TO-220AB RoHS: Compliant Status: Obsolete Min Qty: 1 3380
  • 1 $0.4333
  • 25 $0.4246
  • 100 $0.4073
  • 500 $0.3900
  • 1,000 $0.3683
$0.3683 / $0.4333 Buy Now

Part Details for BUK9535-100A,127

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BUK9535-100A,127 Part Data Attributes

BUK9535-100A,127 NXP Semiconductors
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BUK9535-100A,127 NXP Semiconductors N-channel TrenchMOS logic level FET TO-220 3-Pin
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Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code TO-220
Package Description PLASTIC, SC-46, 3 PIN
Pin Count 3
Manufacturer Package Code SOT78A
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8541.29.00.75
Factory Lead Time 4 Weeks
Avalanche Energy Rating (Eas) 125 mJ
Case Connection DRAIN
Configuration SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 100 V
Drain Current-Max (ID) 41 A
Drain-source On Resistance-Max 0.039 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code TO-220AB
JESD-30 Code R-PSFM-T3
JESD-609 Code e3
Number of Elements 1
Number of Terminals 3
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 175 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style FLANGE MOUNT
Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 149 W
Pulsed Drain Current-Max (IDM) 165 A
Qualification Status Not Qualified
Surface Mount NO
Terminal Finish TIN
Terminal Form THROUGH-HOLE
Terminal Position SINGLE
Transistor Application SWITCHING
Transistor Element Material SILICON

Alternate Parts for BUK9535-100A,127

This table gives cross-reference parts and alternative options found for BUK9535-100A,127. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BUK9535-100A,127, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
934055656127 NXP Semiconductors Check for Price TRANSISTOR 41 A, 100 V, 0.039 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB, PLASTIC, SC-46, 3 PIN, FET General Purpose Power BUK9535-100A,127 vs 934055656127
934055656127 Nexperia Check for Price Power Field-Effect Transistor BUK9535-100A,127 vs 934055656127
BUK9535-100A NXP Semiconductors Check for Price TRANSISTOR 41 A, 100 V, 0.039 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB, PLASTIC, SC-46, 3 PIN, FET General Purpose Power BUK9535-100A,127 vs BUK9535-100A
BUK9535-100A,127 Nexperia Check for Price N-channel TrenchMOS logic level FET@en-us TO-220 3-Pin BUK9535-100A,127 vs BUK9535-100A,127
BUK9535-100A Nexperia Check for Price Power Field-Effect Transistor BUK9535-100A,127 vs BUK9535-100A

BUK9535-100A,127 Frequently Asked Questions (FAQ)

  • A good PCB layout for optimal thermal performance involves placing the device on a thick copper plane, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components. A minimum of 2 oz copper thickness is recommended.

  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves, ensure good thermal design, and consider using a heat sink or thermal interface material. Additionally, verify that the device is operated within the specified maximum junction temperature (Tj).

  • The recommended soldering conditions for the BUK9535-100A,127 are: peak temperature 260°C, time above 217°C 30s, and time above 240°C 10s. It's also important to follow the IPC J-STD-020 standard for reflow soldering.

  • Yes, the BUK9535-100A,127 is suitable for high-reliability and automotive applications. It's AEC-Q101 qualified and meets the requirements for automotive-grade power MOSFETs. However, it's essential to follow the recommended design and testing guidelines for these applications.

  • To calculate the power dissipation, use the formula Pd = I^2 * Rds(on) * duty cycle. Then, use the thermal resistance (Rth(j-a)) and the calculated power dissipation to estimate the junction temperature (Tj) using the formula Tj = Tc + Pd * Rth(j-a), where Tc is the case temperature.