Part Details for BU941ZP by STMicroelectronics
Results Overview of BU941ZP by STMicroelectronics
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Energy and Power Systems
Renewable Energy
Automotive
BU941ZP Information
BU941ZP by STMicroelectronics is a Power Bipolar Transistor.
Power Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for BU941ZP
| Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | TRANSISTOR,BJT,DARLINGTON,NPN,350V V(BR)CEO,15A I(C),TO-218VAR | 75 |
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$1.4625 / $2.4375 | Buy Now |
Part Details for BU941ZP
BU941ZP CAD Models
BU941ZP Part Data Attributes
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BU941ZP
STMicroelectronics
Buy Now
Datasheet
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Compare Parts:
BU941ZP
STMicroelectronics
15A, 350V, NPN, Si, POWER TRANSISTOR, TO-247, ROHS COMPLIANT PACKAGE-3
Select a part to compare: |
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | TO-247 | |
| Package Description | ROHS COMPLIANT PACKAGE-3 | |
| Pin Count | 3 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.29.00.95 | |
| Samacsys Manufacturer | STMicroelectronics | |
| Collector Current-Max (IC) | 15 A | |
| Collector-Emitter Voltage-Max | 350 V | |
| Configuration | DARLINGTON WITH BUILT-IN DIODE AND RESISTOR | |
| DC Current Gain-Min (hFE) | 300 | |
| JEDEC-95 Code | TO-247 | |
| JESD-30 Code | R-PSFM-T3 | |
| JESD-609 Code | e3 | |
| Number of Elements | 1 | |
| Number of Terminals | 3 | |
| Operating Temperature-Max | 175 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | FLANGE MOUNT | |
| Polarity/Channel Type | NPN | |
| Power Dissipation Ambient-Max | 155 W | |
| Power Dissipation-Max (Abs) | 155 W | |
| Qualification Status | Not Qualified | |
| Surface Mount | NO | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | SINGLE | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON | |
| VCEsat-Max | 2 V |
Alternate Parts for BU941ZP
This table gives cross-reference parts and alternative options found for BU941ZP. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BU941ZP, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| BU931ZP | STMicroelectronics | Check for Price | 20A, 350V, NPN, Si, POWER TRANSISTOR, TO-218 | BU941ZP vs BU931ZP |
| BUB323ZG | onsemi | Check for Price | NPN Darlington Bipolar Power Transistor, D2PAK 2 LEAD, 50-TUBE | BU941ZP vs BUB323ZG |
| BU941ZPFI | STMicroelectronics | $2.2259 | Automotive-grade high voltage ignition coil driver NPN power Darlington transistor | BU941ZP vs BU941ZPFI |
| BUB323ZT4 | onsemi | Check for Price | NPN Darlington Bipolar Power Transistor, D2PAK 2 LEAD, 800-REEL | BU941ZP vs BUB323ZT4 |
| BU323Z | Motorola Mobility LLC | Check for Price | 10A, 350V, NPN, Si, POWER TRANSISTOR, TO-218 | BU941ZP vs BU323Z |
BU941ZP Frequently Asked Questions (FAQ)
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A good PCB layout for the BU941ZP should include a solid ground plane, wide power traces, and a thermal relief pattern under the package to facilitate heat dissipation. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
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To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, consider using a thermal sensor to monitor the device temperature and implement thermal shutdown or throttling if necessary.
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The BU941ZP has limited short-circuit current handling, which means it's essential to ensure that the output is protected from short circuits. This can be achieved by adding external protection components, such as fuses or current-limiting resistors, and designing the system to minimize the risk of short circuits.
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To optimize the BU941ZP's performance for low-voltage operation, ensure that the input voltage is within the recommended range, and consider using a voltage regulator or a low-dropout regulator to maintain a stable input voltage. Additionally, optimize the output capacitor selection and layout to minimize voltage drops and ensure stable operation.
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To minimize EMI and RFI issues with the BU941ZP, follow proper PCB layout practices, such as separating analog and digital grounds, using shielding, and implementing filtering and decoupling techniques. Additionally, consider using EMI filters or common-mode chokes to reduce emissions and improve immunity.