Part Details for BU2501FV by ROHM Semiconductor
Overview of BU2501FV by ROHM Semiconductor
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- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Energy and Power Systems
Renewable Energy
Part Details for BU2501FV
BU2501FV CAD Models
BU2501FV Part Data Attributes
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BU2501FV
ROHM Semiconductor
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Datasheet
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BU2501FV
ROHM Semiconductor
D/A Converter, 1 Func, Serial Input Loading, 70us Settling Time, PDSO20, 0.65 MM PITCH, SSOP-20
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ROHM CO LTD | |
Part Package Code | SSOP | |
Package Description | LSSOP, TSSOP20,.25 | |
Pin Count | 20 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Analog Output Voltage-Max | 2.9 V | |
Analog Output Voltage-Min | 0.1 V | |
Converter Type | D/A CONVERTER | |
Input Bit Code | BINARY | |
Input Format | SERIAL | |
JESD-30 Code | R-PDSO-G20 | |
JESD-609 Code | e3/e2 | |
Length | 6.5 mm | |
Linearity Error-Max (EL) | 0.5859% | |
Number of Bits | 8 | |
Number of Functions | 1 | |
Number of Terminals | 20 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -25 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LSSOP | |
Package Equivalence Code | TSSOP20,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.25 mm | |
Settling Time-Max | 250 µs | |
Settling Time-Nom (tstl) | 70 µs | |
Supply Current-Max | 1.2 mA | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Temperature Grade | OTHER | |
Terminal Finish | TIN/TIN COPPER | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 10 | |
Width | 4.4 mm |