Part Details for BU-67301B0T0L-102 by Data Device Corporation
Overview of BU-67301B0T0L-102 by Data Device Corporation
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for BU-67301B0T0L-102
BU-67301B0T0L-102 CAD Models
BU-67301B0T0L-102 Part Data Attributes
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BU-67301B0T0L-102
Data Device Corporation
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Datasheet
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BU-67301B0T0L-102
Data Device Corporation
Mil-Std-1553 Controller, CMOS,
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | DATA DEVICE CORP | |
| Package Description | FBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.31.00.01 | |
| Additional Feature | 40 MHZ NOMINAL CLOCK AVAILABLE | |
| Address Bus Width | 16 | |
| Boundary Scan | YES | |
| Bus Compatibility | PCI; USB | |
| Clock Frequency-Max | 40 MHz | |
| Communication Protocol | IEEE1394A | |
| Data Encoding/Decoding Method | BIPH-LEVEL (MANCHESTER) | |
| Data Transfer Rate-Max | 0.125 MBps | |
| External Data Bus Width | 32 | |
| JESD-30 Code | S-PBGA-B324 | |
| Length | 16 mm | |
| Low Power Mode | YES | |
| Number of Serial I/Os | 2 | |
| Number of Terminals | 324 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 4.7 mm | |
| Supply Voltage-Max | 1.95 V | |
| Supply Voltage-Min | 1.65 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 16 mm | |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 |