Part Details for BU-64860B3-E02 by Data Device Corporation
Overview of BU-64860B3-E02 by Data Device Corporation
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for BU-64860B3-E02
BU-64860B3-E02 CAD Models
BU-64860B3-E02 Part Data Attributes
|
|
BU-64860B3-E02
Data Device Corporation
Buy Now
Datasheet
|
Compare Parts:
BU-64860B3-E02
Data Device Corporation
Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, PBGA324, BGA-324
|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | DATA DEVICE CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA324,18X18,40 | |
| Pin Count | 324 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Additional Feature | ALSO OPERATES AT 5V SUPPLY | |
| Address Bus Width | 16 | |
| Boundary Scan | NO | |
| Clock Frequency-Max | 20 MHz | |
| Communication Protocol | MIL STD 1553A; MIL STD 1553B; MCAIR; STANAG-3838 | |
| Data Encoding/Decoding Method | BIPH-LEVEL(MANCHESTER) | |
| Data Transfer Rate-Max | 0.125 MBps | |
| External Data Bus Width | 16 | |
| JESD-30 Code | S-PBGA-B324 | |
| JESD-609 Code | e0 | |
| Length | 20.7 mm | |
| Low Power Mode | YES | |
| Number of Serial I/Os | 2 | |
| Number of Terminals | 324 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA324,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-STD-883 | |
| Seated Height-Max | 3.05 mm | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 20.7 mm | |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 |
Alternate Parts for BU-64860B3-E02
This table gives cross-reference parts and alternative options found for BU-64860B3-E02. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BU-64860B3-E02, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| BU-61843G3-220Z | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 2.54 MM HEIGHT, CERAMIC, QFP-72 | Data Device Corporation | BU-64860B3-E02 vs BU-61843G3-220Z |
| BU-61843G3-660Z | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-64860B3-E02 vs BU-61843G3-660Z |
| BU-61743G3-262W | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-64860B3-E02 vs BU-61743G3-262W |
| BU-61743G3-102L | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 2.54 MM HEIGHT, CERAMIC, QFP-72 | Data Device Corporation | BU-64860B3-E02 vs BU-61743G3-102L |
| BU-61843G3-772L | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-64860B3-E02 vs BU-61843G3-772L |
| BU-61843G3-440Z | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 2.54 MM HEIGHT, CERAMIC, QFP-72 | Data Device Corporation | BU-64860B3-E02 vs BU-61843G3-440Z |
| BU-61743F3-320K | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-64860B3-E02 vs BU-61743F3-320K |
| BU-61843G4-570Y | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-64860B3-E02 vs BU-61843G4-570Y |
| BU-61743F3-142Y | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-64860B3-E02 vs BU-61743F3-142Y |
| BU-61743F3-100K | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CQFP72, 25.40 X 25.40 MM, 3.94 MM HEIGHT, CERAMIC, FP-72 | Data Device Corporation | BU-64860B3-E02 vs BU-61743F3-100K |