Part Details for BU-64843T8-E02 by Data Device Corporation
Results Overview of BU-64843T8-E02 by Data Device Corporation
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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BU-64843T8-E02 Information
BU-64843T8-E02 by Data Device Corporation is a Serial IO/Communication Controller.
Serial IO/Communication Controllers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for BU-64843T8-E02
BU-64843T8-E02 CAD Models
BU-64843T8-E02 Part Data Attributes
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BU-64843T8-E02
Data Device Corporation
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Datasheet
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BU-64843T8-E02
Data Device Corporation
Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, PBGA312, BGA-312
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | DATA DEVICE CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA312,13X24,40 | |
| Pin Count | 312 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | DDC | |
| Address Bus Width | 16 | |
| Boundary Scan | NO | |
| Bus Compatibility | MIL-STD-1553 | |
| Clock Frequency-Max | 20 MHz | |
| Communication Protocol | MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838 | |
| Data Encoding/Decoding Method | BIPH-LEVEL(MANCHESTER) | |
| Data Transfer Rate-Max | 1 MBps | |
| External Data Bus Width | 16 | |
| JESD-30 Code | R-PBGA-B312 | |
| JESD-609 Code | e0 | |
| Length | 27.9 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Serial I/Os | 2 | |
| Number of Terminals | 312 | |
| On Chip Data RAM Width | 16 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA312,13X24,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (words) | 2048 | |
| Screening Level | MIL-STD-883 | |
| Seated Height-Max | 4.7 mm | |
| Supply Current-Max | 931 mA | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | HYBRID | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 15.2 mm | |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 |