Part Details for BSC9132NSE7KNKB by NXP Semiconductors
Overview of BSC9132NSE7KNKB by NXP Semiconductors
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Smart Cities
Renewable Energy
Robotics and Drones
Price & Stock for BSC9132NSE7KNKB
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
BSC9132NSE7KNKB
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Avnet Americas | 9132 R1.1 ST WE 1.0GHZ - Trays (Alt: BSC9132NSE7KNKB) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Container: Tray | 0 |
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RFQ | |
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DISTI #
86096376
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Verical | MPU QorIQ BSC9132 RISC 32bit 45nm 1GHz 780-Pin FCBGA Tray RoHS: Compliant Min Qty: 3 Package Multiple: 1 Date Code: 1501 | Americas - 40 |
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$130.6375 / $153.6875 | Buy Now |
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Rochester Electronics | BSC9132 - Qoriq Qonverge Multicore Baseband Processor RoHS: Compliant Status: Obsolete Min Qty: 1 | 40 |
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$104.5100 / $122.9500 | Buy Now |
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Flip Electronics | Stock | 271 |
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RFQ |
Part Details for BSC9132NSE7KNKB
BSC9132NSE7KNKB CAD Models
BSC9132NSE7KNKB Part Data Attributes
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BSC9132NSE7KNKB
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
BSC9132NSE7KNKB
NXP Semiconductors
RISC PROCESSOR
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| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | FCBGA-780 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Address Bus Width | 16 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B780 | |
| JESD-609 Code | e1 | |
| Length | 23 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 780 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 245 | |
| Seated Height-Max | 2.53 mm | |
| Speed | 1000 MHz | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.97 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |