There are no models available for this part yet.
Overview of BSC9132NSE7KNKB by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 4 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Smart Cities
Renewable Energy
Robotics and Drones
Price & Stock for BSC9132NSE7KNKB by NXP Semiconductors
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
44X7203
|
Newark | Qoriq Qonverge Soc, 2X1Ghz Starcore Dsp, 2X1Ghz E500 Cpu, Maple-B2P Accelerator, Ddr3, Sec, 0-105C/Tray, Bakeable, Multiple In Drypack Rohs Compliant: Yes |Nxp BSC9132NSE7KNKB RoHS: Compliant Min Qty: 60 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$99.5900 / $105.9700 | Buy Now | |
DISTI #
BSC9132NSE7KNKB
|
Avnet Americas | 9132 R1.1 ST WE 1.0GHZ - Trays (Alt: BSC9132NSE7KNKB) RoHS: Compliant Min Qty: 3 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 464 Partner Stock |
|
RFQ | ||
Rochester Electronics | BSC9132 - Qoriq Qonverge Multicore Baseband Processor RoHS: Compliant Status: Obsolete Min Qty: 1 | 40 |
|
$109.7400 / $129.1000 | Buy Now | ||
Flip Electronics | Stock | 271 |
|
RFQ |
CAD Models for BSC9132NSE7KNKB by NXP Semiconductors
Part Data Attributes for BSC9132NSE7KNKB by NXP Semiconductors
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
End Of Life
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
Package Description
|
FCBGA-780
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
5A002.A.1
|
HTS Code
|
8542.31.00.01
|
Factory Lead Time
|
4 Weeks
|
Samacsys Manufacturer
|
NXP
|
Address Bus Width
|
16
|
Bit Size
|
32
|
Boundary Scan
|
YES
|
External Data Bus Width
|
32
|
Format
|
FIXED POINT
|
Integrated Cache
|
YES
|
JESD-30 Code
|
S-PBGA-B780
|
JESD-609 Code
|
e1
|
Length
|
23 mm
|
Low Power Mode
|
YES
|
Moisture Sensitivity Level
|
3
|
Number of Terminals
|
780
|
Operating Temperature-Max
|
105 °C
|
Operating Temperature-Min
|
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
FBGA
|
Package Shape
|
SQUARE
|
Package Style
|
GRID ARRAY, FINE PITCH
|
Peak Reflow Temperature (Cel)
|
245
|
Seated Height-Max
|
2.53 mm
|
Speed
|
1000 MHz
|
Supply Voltage-Max
|
1.05 V
|
Supply Voltage-Min
|
0.97 V
|
Supply Voltage-Nom
|
1 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
OTHER
|
Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form
|
BALL
|
Terminal Pitch
|
0.8 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Width
|
23 mm
|
uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR, RISC
|
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