Part Details for BSC9131NJE1HHHB by NXP Semiconductors
Overview of BSC9131NJE1HHHB by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Transportation and Logistics
Healthcare
Renewable Energy
Automotive
Robotics and Drones
Price & Stock for BSC9131NJE1HHHB
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
|
Flip Electronics | Stock | 60 |
|
RFQ |
Part Details for BSC9131NJE1HHHB
BSC9131NJE1HHHB CAD Models
BSC9131NJE1HHHB Part Data Attributes:
|
BSC9131NJE1HHHB
NXP Semiconductors
Buy Now
|
Compare Parts:
BSC9131NJE1HHHB
NXP Semiconductors
RISC PROCESSOR
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | FCBGA-520 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 5A002.A.1 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Address Bus Width | 16 | |
Bit Size | 32 | |
Boundary Scan | YES | |
External Data Bus Width | 32 | |
Format | FIXED POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B520 | |
JESD-609 Code | e1 | |
Length | 21 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 520 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Peak Reflow Temperature (Cel) | 245 | |
Seated Height-Max | 1.97 mm | |
Speed | 800 MHz | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 0.97 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 21 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |