Part Details for BR25G256-3 by ROHM Semiconductor
Overview of BR25G256-3 by ROHM Semiconductor
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for BR25G256-3
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
BR25G256-3
|
Avnet Silica | EEPROM Serial-SPI 256K-bit 32K x 8 1.8V/2.5V/3.3V/5V 8-Pin DIP-T Tube (Alt: BR25G256-3) RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 13 Weeks, 0 Days | Silica - 0 |
|
Buy Now | |
|
CoreStaff Co Ltd | RoHS(Ship within 1day) - D/C | 24 |
|
$0.7310 / $1.8570 | Buy Now |
Part Details for BR25G256-3
BR25G256-3 CAD Models
BR25G256-3 Part Data Attributes:
|
BR25G256-3
ROHM Semiconductor
Buy Now
Datasheet
|
Compare Parts:
BR25G256-3
ROHM Semiconductor
EEPROM, 32KX8, Serial, CMOS, PDIP8, 9.30 X 6.50 MM, 7.10 MM HEIGHT, DIP-8
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ROHM CO LTD | |
Package Description | DIP, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Samacsys Manufacturer | ROHM Semiconductor | |
Additional Feature | ALSO OPERATES WITH 2.5V @10 MHZ AND 1.7V MIN @ 5 MHZ | |
Clock Frequency-Max (fCLK) | 20 MHz | |
Data Retention Time-Min | 100 | |
Endurance | 1000000 Write/Erase Cycles | |
JESD-30 Code | R-PDIP-T8 | |
Length | 9.3 mm | |
Memory Density | 262144 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 32KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP8,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programming Voltage | 5 V | |
Seated Height-Max | 3.7 mm | |
Serial Bus Type | SPI | |
Standby Current-Max | 0.000002 A | |
Supply Current-Max | 0.008 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 7.62 mm | |
Write Cycle Time-Max (tWC) | 5 ms | |
Write Protection | HARDWARE |
Alternate Parts for BR25G256-3
This table gives cross-reference parts and alternative options found for BR25G256-3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BR25G256-3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
BR25G256F-3GE2 | EEPROM, 32KX8, Serial, CMOS, PDSO8, 5 X 6.20 MM, 1.71 MM HEIGHT, HALOGEN FREE, SOP-8 | ROHM Semiconductor | BR25G256-3 vs BR25G256F-3GE2 |