Datasheets
BQ4017MC-70 by:

2MX8 NON-VOLATILE SRAM MODULE, 70ns, PDIP36

Part Details for BQ4017MC-70 by Texas Instruments

Overview of BQ4017MC-70 by Texas Instruments

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Applications Consumer Electronics Energy and Power Systems Renewable Energy Automotive

Part Details for BQ4017MC-70

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BQ4017MC-70 Part Data Attributes:

BQ4017MC-70 Texas Instruments
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BQ4017MC-70 Texas Instruments 2MX8 NON-VOLATILE SRAM MODULE, 70ns, PDIP36
Pbfree Code No
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC
Package Description DIP, DIP36,.6
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 70 ns
Additional Feature 5 YEARS OF DATA RETENTION
JESD-30 Code R-XDMA-T36
Length 52.96 mm
Memory Density 16777216 bit
Memory IC Type NON-VOLATILE SRAM MODULE
Memory Width 8
Number of Functions 1
Number of Terminals 36
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2MX8
Package Body Material UNSPECIFIED
Package Code DIP
Package Equivalence Code DIP36,.6
Package Shape RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 9.53 mm
Standby Current-Max 0.017 A
Supply Current-Max 0.115 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 18.415 mm

Alternate Parts for BQ4017MC-70

This table gives cross-reference parts and alternative options found for BQ4017MC-70. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BQ4017MC-70, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
BQ4017MC-70 Non-Volatile SRAM Module, 2MX8, 70ns, CMOS, PDIP36, Benchmarq Microelectronics Inc BQ4017MC-70 vs BQ4017MC-70
DS1270AB-70IND Non-Volatile SRAM Module, 2MX8, 70ns, CMOS, PDMA36, 0.740 INCH, DIP-36 Maxim Integrated Products BQ4017MC-70 vs DS1270AB-70IND
DS1270AB-70+ 2MX8 NON-VOLATILE SRAM MODULE, 70ns, PDMA36, 0.740 INCH, ROHS COMPLIANT, EXTENDED MODULE-36 Maxim Integrated Products BQ4017MC-70 vs DS1270AB-70+
Part Number Description Manufacturer Compare
WS512K32-70G2TIE SRAM Module, 2MX8, 70ns, CMOS, CQMA68, Mercury Systems Inc BQ4017MC-70 vs WS512K32-70G2TIE
WS512K32-120G2Q SRAM Module, 2MX8, 120ns, CMOS, CQFP68, CERAMIC, QFP-68 White Electronic Designs Corp BQ4017MC-70 vs WS512K32-120G2Q
WS512K32N-70H2I SRAM Module, 2MX8, 70ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp BQ4017MC-70 vs WS512K32N-70H2I
SYS82000RKXCLI-85 SRAM Module, 2MX8, 85ns, CMOS, PSMA38, PLASTIC, SIP-38 Mosaic Semiconductor Inc BQ4017MC-70 vs SYS82000RKXCLI-85
WS512K32N-120H2QE SRAM Module, 2MX8, 120ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 White Electronic Designs Corp BQ4017MC-70 vs WS512K32N-120H2QE
SYS82000FKXA-10 SRAM Module, 2MX8, 100ns, CMOS, PDIP36, PLASTIC, DIP-36 Mosaic Semiconductor Inc BQ4017MC-70 vs SYS82000FKXA-10
SYS82000RKXCI-10 SRAM Module, 2MX8, 100ns, CMOS, PSMA38, PLASTIC, SIP-38 Mosaic Semiconductor Inc BQ4017MC-70 vs SYS82000RKXCI-10
DS1270AB-100-IND Non-Volatile SRAM Module, 2MX8, 100ns, CMOS, PDMA36, 0.740 INCH, DIP-36 Maxim Integrated Products BQ4017MC-70 vs DS1270AB-100-IND
BQ4017YMC-70 2MX8 NON-VOLATILE SRAM MODULE, 70ns, DMA36, MODULE, DIP-36 Texas Instruments BQ4017MC-70 vs BQ4017YMC-70
WS512K32-100G2TQEA SRAM Module, 2MX8, 100ns, CMOS, CQMA68, Mercury Systems Inc BQ4017MC-70 vs WS512K32-100G2TQEA

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