There are no models available for this part yet.
Overview of BLL1214-35,112 by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
BLL1214-250 | Rochester Electronics LLC | BLL1214-250 - HF/VHF Power Transistor (Ampleon Die) | |
BLL1214-35 | Rochester Electronics | BLL1214-35 - HF/VHF Power Transistor (Ampleon Die) |
CAD Models for BLL1214-35,112 by NXP Semiconductors
Part Data Attributes for BLL1214-35,112 by NXP Semiconductors
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
Part Package Code
|
SOT
|
Package Description
|
CERAMIC PACKAGE-3
|
Pin Count
|
2
|
Manufacturer Package Code
|
SOT467C
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8541.29.00.75
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Case Connection
|
SOURCE
|
Configuration
|
SINGLE
|
DS Breakdown Voltage-Min
|
75 V
|
FET Technology
|
METAL-OXIDE SEMICONDUCTOR
|
Highest Frequency Band
|
L BAND
|
JESD-30 Code
|
R-CDFM-F2
|
Number of Elements
|
1
|
Number of Terminals
|
2
|
Operating Mode
|
ENHANCEMENT MODE
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Operating Temperature-Max
|
200 °C
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Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
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Package Shape
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RECTANGULAR
|
Package Style
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FLANGE MOUNT
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Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Polarity/Channel Type
|
N-CHANNEL
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Power Dissipation-Max (Abs)
|
110 W
|
Qualification Status
|
Not Qualified
|
Surface Mount
|
YES
|
Terminal Form
|
FLAT
|
Terminal Position
|
DUAL
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Transistor Application
|
AMPLIFIER
|
Transistor Element Material
|
SILICON
|