There are no models available for this part yet.
Overview of BLF888AS by NXP Semiconductors
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for BLF888AS by NXP Semiconductors
Part Data Attributes for BLF888AS by NXP Semiconductors
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
Package Description
|
FLATPACK, R-CDFP-F4
|
Pin Count
|
4
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
Additional Feature
|
HIGH RELIABILITY
|
Case Connection
|
SOURCE
|
Configuration
|
COMMON SOURCE, 2 ELEMENTS
|
DS Breakdown Voltage-Min
|
110 V
|
FET Technology
|
METAL-OXIDE SEMICONDUCTOR
|
Highest Frequency Band
|
ULTRA HIGH FREQUENCY BAND
|
JESD-30 Code
|
R-CDFP-F4
|
Number of Elements
|
2
|
Number of Terminals
|
4
|
Operating Mode
|
ENHANCEMENT MODE
|
Operating Temperature-Max
|
200 °C
|
Package Body Material
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape
|
RECTANGULAR
|
Package Style
|
FLATPACK
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Polarity/Channel Type
|
N-CHANNEL
|
Qualification Status
|
Not Qualified
|
Surface Mount
|
YES
|
Terminal Form
|
FLAT
|
Terminal Position
|
DUAL
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Transistor Application
|
AMPLIFIER
|
Transistor Element Material
|
SILICON
|
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