Part Details for BGA777N7E6327XTSA1 by Infineon Technologies AG
Overview of BGA777N7E6327XTSA1 by Infineon Technologies AG
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for BGA777N7E6327XTSA1
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
BGA777N7E6327XTSA1CT-ND
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DigiKey | IC AMP UMTS 2.3-2.7GHZ TSNP7-1 Min Qty: 1 Lead time: 10 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
6455 In Stock |
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$0.5949 / $1.2500 | Buy Now |
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Rochester Electronics | BGA777N7 - Single-Band UMTS LNA ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 30000 |
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$0.3039 / $0.3575 | Buy Now |
Part Details for BGA777N7E6327XTSA1
BGA777N7E6327XTSA1 CAD Models
BGA777N7E6327XTSA1 Part Data Attributes
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BGA777N7E6327XTSA1
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
BGA777N7E6327XTSA1
Infineon Technologies AG
RF and Baseband Circuit, PDSO6, 2 X 1.30 MM, 0.39 MM HEIGHT, GREEN, TSNP-7/6
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | HVSON, | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Samacsys Manufacturer | Infineon | |
| JESD-30 Code | R-PDSO-N6 | |
| JESD-609 Code | e3 | |
| Length | 2 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 6 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -30 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVSON | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Seated Height-Max | 0.4 mm | |
| Supply Voltage-Nom | 2.8 V | |
| Surface Mount | YES | |
| Telecom IC Type | RF AND BASEBAND CIRCUIT | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Width | 1.3 mm |