Part Details for BGA7210 by NXP Semiconductors
Overview of BGA7210 by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for BGA7210
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2832-BGA7210-ND
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DigiKey | RF AND BASEBAND CIRCUIT, PQCC32 Min Qty: 10 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
10 In Stock |
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$50.0000 | Buy Now |
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Flip Electronics | Stock, ship today | 10 |
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$0.5100 | RFQ |
Part Details for BGA7210
BGA7210 CAD Models
BGA7210 Part Data Attributes:
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BGA7210
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
BGA7210
NXP Semiconductors
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PQCC32, 5 X 5 MM, 0.85 MM, PLASTIC, SOT617-1, MO-220, HVQFN-32
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | HVQFN-32 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | S-PQCC-N32 | |
| Length | 5 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 0.85 mm | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Telecom IC Type | RF AND BASEBAND CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 5 mm |