Datasheets
BGA6489,135 by: NXP Semiconductors

BGA6489 - MMIC wideband medium power amplifier SOT-89 3-Pin

Part Details for BGA6489,135 by NXP Semiconductors

Results Overview of BGA6489,135 by NXP Semiconductors

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Applications Environmental Monitoring Space Technology Telecommunications

BGA6489,135 Information

BGA6489,135 by NXP Semiconductors is an RF/Microwave Amplifier.
RF/Microwave Amplifiers are under the broader part category of RF and Microwave Components.

RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.

Price & Stock for BGA6489,135

Part # Distributor Description Stock Price Buy
Rochester Electronics IC MMIC AMPLIFIER SOT89 RoHS: Compliant Status: Obsolete Min Qty: 1 33
  • 1 $0.9533
  • 25 $0.9342
  • 100 $0.8961
  • 500 $0.8580
  • 1,000 $0.8103
$0.8103 / $0.9533 Buy Now
DISTI # BGA6489,135
Avnet Silica MMIC Wideband Medium Power Amplifier 850 MHz to 195 GHz 3 Pins SC62 (Alt: BGA6489,135) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Silica - 0
Buy Now
DISTI # BGA6489,135
EBV Elektronik MMIC Wideband Medium Power Amplifier 850 MHz to 195 GHz 3 Pins SC62 (Alt: BGA6489,135) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 EBV - 0
Buy Now

Part Details for BGA6489,135

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BGA6489,135 Part Data Attributes

BGA6489,135 NXP Semiconductors
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BGA6489,135 NXP Semiconductors BGA6489 - MMIC wideband medium power amplifier SOT-89 3-Pin
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Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code SOT-89
Package Description PLASTIC, SC-62, TO-243, SOT-89, 3 PIN
Pin Count 3
Manufacturer Package Code SOT89
Reach Compliance Code compliant
HTS Code 8542.33.00.01
Samacsys Manufacturer NXP
Characteristic Impedance 50 Ω
Construction COMPONENT
Gain 15 dB
Input Power-Max (CW) 15 dBm
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Functions 1
Number of Terminals 3
Operating Frequency-Max 2500 MHz
Operating Frequency-Min 850 MHz
Package Body Material PLASTIC/EPOXY
Package Equivalence Code TO-243
Power Supplies 8 V
RF/Microwave Device Type WIDE BAND LOW POWER
Supply Current-Max 86 mA
Surface Mount YES
Terminal Finish Tin (Sn)

Alternate Parts for BGA6489,135

This table gives cross-reference parts and alternative options found for BGA6489,135. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BGA6489,135, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
BGA6489 NXP Semiconductors Check for Price RF/Microwave Amplifier, 850 MHz - 2500 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER, PLASTIC, SC-62, TO-243, SOT-89, 3 PIN BGA6489,135 vs BGA6489

BGA6489,135 Related Parts

BGA6489,135 Frequently Asked Questions (FAQ)

  • NXP recommends a 4-layer PCB with a dedicated ground plane, and thermal vias under the package to improve heat dissipation. A thermal pad on the bottom of the package should be connected to a solid ground plane to reduce thermal resistance.

  • Use a multi-layer PCB with separate power and ground planes, and decouple the power supply with 10uF and 100nF capacitors. Ensure the power supply voltage is within the recommended range of 1.14V to 1.26V.

  • Pay attention to signal routing, especially for high-speed signals like PCIe and SATA. Use controlled impedance traces, and consider using differential pairs for clock signals. Also, ensure that the signal lines are not routed near the package's thermal balls.

  • The thermal shutdown feature is enabled by default. To disable it, tie the TSD pin to VCC. When enabled, the device will shut down when the junction temperature exceeds 125°C. Ensure your system design can handle this shutdown scenario.

  • The PLL settings depend on the specific application. Consult the NXP application note AN11535 for recommended PLL settings and clocking system configuration. Ensure the clock frequency is within the recommended range of 100MHz to 200MHz.