There are no models available for this part yet.
Overview of BCP53-16115 by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Not Available )
- Reference Designs: ( Not Available )
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
68016-115HLF | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 15 Positions, 2.54 mm (0.100) Pitch. | |
54122-807161150LF | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch | |
87916-115HLF | Amphenol Communications Solutions | BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 15 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail. |
Price & Stock for BCP53-16115 by NXP Semiconductors
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
Chip-Germany GmbH | RoHS: Not Compliant | 1638 |
|
RFQ |