Datasheets
BCM54185B0IFBG by:
Broadcom Limited
Broadcom Limited
Brocade
Not Found

Ethernet Transceiver, 8-Trnsvr, CMOS, PBGA400, FBGA-400

Part Details for BCM54185B0IFBG by Broadcom Limited

Results Overview of BCM54185B0IFBG by Broadcom Limited

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BCM54185B0IFBG Information

BCM54185B0IFBG by Broadcom Limited is a Network Interface.
Network Interfaces are under the broader part category of Telecommunication Circuits.

A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.

Price & Stock for BCM54185B0IFBG

Part # Distributor Description Stock Price Buy
DISTI # 2832-BCM54185B0IFBG-ND
DigiKey IC TXRX 8/8 400 FBGA 21X21 Min Qty: 50 Lead time: 50 Weeks Container: Tray MARKETPLACE PRODUCT 1121
In Stock
  • 50 $19.2000
$19.2000 Buy Now
DISTI # 516-BCM54185B0IFBG-ND
DigiKey IC TXRX 8/8 400 FBGA 21X21 Min Qty: 50 Lead time: 50 Weeks Container: Tray Temporarily Out of Stock
Buy Now
DISTI # BCM54185B0IFBG
EBV Elektronik BCM54185B0IFBG (Alt: BCM54185B0IFBG) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 52 Weeks, 0 Days EBV - 0
Buy Now
Flip Electronics Stock, ship today 1121
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Part Details for BCM54185B0IFBG

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BCM54185B0IFBG Part Data Attributes

BCM54185B0IFBG Broadcom Limited
Buy Now Datasheet
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BCM54185B0IFBG Broadcom Limited Ethernet Transceiver, 8-Trnsvr, CMOS, PBGA400, FBGA-400
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer BROADCOM INC
Package Description FBGA-400
Reach Compliance Code compliant
JESD-30 Code R-PBGA-B400
Number of Functions 1
Number of Terminals 400
Number of Transceivers 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Surface Mount YES
Technology CMOS
Telecom IC Type ETHERNET TRANSCEIVER
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Position BOTTOM

BCM54185B0IFBG Frequently Asked Questions (FAQ)

  • Broadcom provides a reference design guide and thermal design guidelines in their application notes and design guides, which can be obtained through their website or by contacting their technical support team.

  • Optimizing power consumption and reducing heat generation can be achieved by using the device's power-saving features, such as dynamic voltage and frequency scaling, and by optimizing the system's power management scheme. Additionally, using a high-efficiency power supply and optimizing the PCB layout can also help reduce heat generation.

  • The recommended settings for the device's registers and configuration pins can be found in the datasheet and application notes. Additionally, Broadcom provides a software development kit (SDK) that includes example code and configuration files to help engineers get started with the device.

  • Troubleshooting issues with the device can be done using a combination of tools, such as packet sniffers, logic analyzers, and debug logs. Broadcom also provides technical support and resources, such as application notes and FAQs, to help engineers troubleshoot common issues.

  • The compliance and regulatory requirements for using the BCM54185B0IFBG in a product depend on the specific application and region. Engineers should consult with Broadcom's technical support team and regulatory experts to ensure compliance with relevant standards and regulations, such as FCC, CE, and RoHS.