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Overview of BAS101S by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for BAS101S by NXP Semiconductors
Part Data Attributes for BAS101S by NXP Semiconductors
|
|
---|---|
Pbfree Code
|
Yes
|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
Package Description
|
PLASTIC, SMD, 3 PIN
|
Pin Count
|
3
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8541.10.00.80
|
Configuration
|
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
Diode Element Material
|
SILICON
|
Diode Type
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF)
|
1.1 V
|
JESD-30 Code
|
R-PDSO-G3
|
JESD-609 Code
|
e3
|
Moisture Sensitivity Level
|
1
|
Non-rep Pk Forward Current-Max
|
9 A
|
Number of Elements
|
2
|
Number of Terminals
|
3
|
Operating Temperature-Max
|
150 °C
|
Output Current-Max
|
0.1 A
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Shape
|
RECTANGULAR
|
Package Style
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel)
|
260
|
Power Dissipation-Max
|
0.25 W
|
Qualification Status
|
Not Qualified
|
Rep Pk Reverse Voltage-Max
|
600 V
|
Reverse Recovery Time-Max
|
0.05 µs
|
Surface Mount
|
YES
|
Terminal Finish
|
Tin (Sn)
|
Terminal Form
|
GULL WING
|
Terminal Position
|
DUAL
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
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