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DIODE 30 V, SILICON, PIN DIODE, PLASTIC, SC-70, 3 PIN, PIN Diode
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Part # | Distributor | Description | Stock | Price | Buy | |
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Chip1Cloud | Silicon PIN diode | 23600 |
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RFQ |
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BAP65-05W
NXP Semiconductors
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Datasheet
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BAP65-05W
NXP Semiconductors
DIODE 30 V, SILICON, PIN DIODE, PLASTIC, SC-70, 3 PIN, PIN Diode
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | SC-70 | |
Package Description | R-PDSO-G3 | |
Pin Count | 3 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8541.10.00 | |
Samacsys Manufacturer | NXP | |
Application | ATTENUATOR; SWITCHING | |
Breakdown Voltage-Min | 30 V | |
Configuration | COMMON CATHODE, 2 ELEMENTS | |
Diode Capacitance-Max | 0.9 pF | |
Diode Capacitance-Nom | 0.7 pF | |
Diode Element Material | SILICON | |
Diode Forward Resistance-Max | 0.9 Ω | |
Diode Res Test Current | 0.5 mA | |
Diode Res Test Frequency | 100 MHz | |
Diode Type | PIN DIODE | |
JESD-30 Code | R-PDSO-G3 | |
JESD-609 Code | e3 | |
Minority Carrier Lifetime-Nom | 0.17 µs | |
Number of Elements | 2 | |
Number of Terminals | 3 | |
Operating Temperature-Max | 150 °C | |
Operating Temperature-Min | -65 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Power Dissipation-Max | 0.24 W | |
Qualification Status | Not Qualified | |
Reverse Test Voltage | ||
Surface Mount | YES | |
Technology | POSITIVE-INTRINSIC-NEGATIVE | |
Terminal Finish | Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 |