Part Details for BAP64-04W by NXP Semiconductors
Results Overview of BAP64-04W by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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BAP64-04W Information
BAP64-04W by NXP Semiconductors is a PIN Diode.
PIN Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Price & Stock for BAP64-04W
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 2462 |
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RFQ |
Part Details for BAP64-04W
BAP64-04W CAD Models
BAP64-04W Part Data Attributes
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BAP64-04W
NXP Semiconductors
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Datasheet
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BAP64-04W
NXP Semiconductors
DIODE SILICON, PIN DIODE, PLASTIC, SC-70, 3 PIN, PIN Diode
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | SC-70 | |
Package Description | SC-70, 3 PIN | |
Pin Count | 3 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8541.10.00 | |
Samacsys Manufacturer | NXP | |
Application | ATTENUATOR; SWITCHING | |
Breakdown Voltage-Min | 100 V | |
Configuration | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS | |
Diode Capacitance-Max | 0.35 pF | |
Diode Capacitance-Nom | 0.52 pF | |
Diode Element Material | SILICON | |
Diode Forward Resistance-Max | 1.35 Ω | |
Diode Res Test Current | 0.5 mA | |
Diode Res Test Frequency | 100 MHz | |
Diode Type | PIN DIODE | |
Frequency Band | S BAND | |
JESD-30 Code | R-PDSO-G3 | |
JESD-609 Code | e3 | |
Minority Carrier Lifetime-Nom | 1.55 µs | |
Moisture Sensitivity Level | 1 | |
Number of Elements | 2 | |
Number of Terminals | 3 | |
Operating Temperature-Max | 150 °C | |
Operating Temperature-Min | -65 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Power Dissipation-Max | 0.24 W | |
Qualification Status | Not Qualified | |
Surface Mount | YES | |
Technology | POSITIVE-INTRINSIC-NEGATIVE | |
Terminal Finish | TIN | |
Terminal Form | GULL WING | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 |