There are no models available for this part yet.
Overview of BAP64-04,215 by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 2 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 6 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Telecommunications
Price & Stock for BAP64-04,215 by NXP Semiconductors
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
C1S537100499264
|
Chip1Stop | Silicon PIN diode RoHS: Compliant pbFree: Yes Container: Cut Tape | 5 |
|
$0.0541 | Buy Now |
CAD Models for BAP64-04,215 by NXP Semiconductors
Part Data Attributes for BAP64-04,215 by NXP Semiconductors
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
|
Part Package Code
|
TO-236
|
|
Package Description
|
PLASTIC, SOT-23, 3 PIN
|
|
Pin Count
|
3
|
|
Manufacturer Package Code
|
SOT23
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8541.10.00
|
|
Samacsys Manufacturer
|
NXP
|
|
Additional Feature
|
HIGH VOLTAGE
|
|
Application
|
ATTENUATOR; SWITCHING
|
|
Breakdown Voltage-Min
|
175 V
|
|
Configuration
|
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
|
Diode Capacitance-Max
|
0.35 pF
|
|
Diode Capacitance-Nom
|
0.52 pF
|
|
Diode Element Material
|
SILICON
|
|
Diode Forward Resistance-Max
|
40 Ω
|
|
Diode Res Test Current
|
0.5 mA
|
|
Diode Res Test Frequency
|
100 MHz
|
|
Diode Type
|
PIN DIODE
|
|
Frequency Band
|
S BAND
|
|
JESD-30 Code
|
R-PDSO-G3
|
|
JESD-609 Code
|
e3
|
|
Minority Carrier Lifetime-Nom
|
1.55 µs
|
|
Moisture Sensitivity Level
|
1
|
|
Number of Elements
|
2
|
|
Number of Terminals
|
3
|
|
Operating Temperature-Max
|
150 °C
|
|
Operating Temperature-Min
|
-65 °C
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
SMALL OUTLINE
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Power Dissipation-Max
|
0.25 W
|
|
Qualification Status
|
Not Qualified
|
|
Surface Mount
|
YES
|
|
Technology
|
POSITIVE-INTRINSIC-NEGATIVE
|
|
Terminal Finish
|
Tin (Sn)
|
|
Terminal Form
|
GULL WING
|
|
Terminal Position
|
DUAL
|
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
Alternate Parts for BAP64-04,215
This table gives cross-reference parts and alternative options found for BAP64-04,215. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BAP64-04,215, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| BAR64-04 | Pin Diode, 150V V(BR), Silicon, ROHS COMPLIANT PACKAGE-3 | Infineon Technologies AG | BAP64-04,215 vs BAR64-04 |
| BAP64-04TRL | DIODE SILICON, PIN DIODE, PIN Diode | NXP Semiconductors | BAP64-04,215 vs BAP64-04TRL |