Part Details for BAP63-01 by NXP Semiconductors
Overview of BAP63-01 by NXP Semiconductors
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for BAP63-01
BAP63-01 CAD Models
BAP63-01 Part Data Attributes:
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BAP63-01
NXP Semiconductors
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BAP63-01
NXP Semiconductors
DIODE 50 V, SILICON, PIN DIODE, ULTRA SMALL, PLASTIC, SMD, 2 PIN, PIN Diode
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | ULTRA SMALL, PLASTIC, SMD, 2 PIN | |
Pin Count | 2 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8541.10.00.80 | |
Application | ATTENUATOR; SWITCHING | |
Breakdown Voltage-Min | 50 V | |
Configuration | SINGLE | |
Diode Capacitance-Max | 0.32 pF | |
Diode Capacitance-Nom | 0.24 pF | |
Diode Element Material | SILICON | |
Diode Forward Resistance-Max | 1.5 Ω | |
Diode Res Test Current | 0.5 mA | |
Diode Res Test Frequency | 100 MHz | |
Diode Type | PIN DIODE | |
Frequency Band | S BAND | |
JESD-30 Code | R-PDSO-F2 | |
Minority Carrier Lifetime-Nom | 0.3 µs | |
Number of Elements | 1 | |
Number of Terminals | 2 | |
Operating Temperature-Max | 150 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Power Dissipation-Max | 0.315 W | |
Qualification Status | Not Qualified | |
Reverse Test Voltage | 20 V | |
Surface Mount | YES | |
Technology | POSITIVE-INTRINSIC-NEGATIVE | |
Terminal Form | FLAT | |
Terminal Position | DUAL |