Part Details for BAP50LX by NXP Semiconductors
Overview of BAP50LX by NXP Semiconductors
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Part Details for BAP50LX
BAP50LX CAD Models
BAP50LX Part Data Attributes:
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BAP50LX
NXP Semiconductors
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BAP50LX
NXP Semiconductors
DIODE SILICON, PIN DIODE, 1 X 0.60 MM, 0.40 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC, SOT882T, 2 PIN, PIN Diode
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | SOT | |
| Package Description | SOT882T, 2 PIN | |
| Pin Count | 2 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Breakdown Voltage-Min | 50 V | |
| Configuration | SINGLE | |
| Diode Capacitance-Max | 0.55 pF | |
| Diode Element Material | SILICON | |
| Diode Forward Resistance-Max | 5 Ω | |
| Diode Type | PIN DIODE | |
| Frequency Band | S BAND | |
| JESD-30 Code | R-PBCC-N2 | |
| JESD-609 Code | e3 | |
| Minority Carrier Lifetime-Nom | 1 µs | |
| Number of Elements | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -65 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Peak Reflow Temperature (Cel) | 260 | |
| Power Dissipation-Max | 0.15 W | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Technology | POSITIVE-INTRINSIC-NEGATIVE | |
| Terminal Finish | TIN | |
| Terminal Form | NO LEAD | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 |