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Part Details for BA891 by NXP Semiconductors
Overview of BA891 by NXP Semiconductors
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Aerospace and Defense
Energy and Power Systems
Part Details for BA891
BA891 CAD Models
BA891 Part Data Attributes:
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BA891
NXP Semiconductors
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BA891
NXP Semiconductors
SILICON, VHF BAND, MIXER DIODE, ULTRA SMALL, PLASTIC, SMD, SC-79, 2 PIN
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | SC-79 | |
| Package Description | ULTRA SMALL, PLASTIC, SMD, SC-79, 2 PIN | |
| Pin Count | 2 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00 | |
| Samacsys Manufacturer | NXP | |
| Configuration | SINGLE | |
| Diode Capacitance-Max | 1.05 pF | |
| Diode Element Material | SILICON | |
| Diode Type | MIXER DIODE | |
| Forward Voltage-Max (VF) | 1 V | |
| Frequency Band | VERY HIGH FREQUENCY | |
| JESD-30 Code | R-PDSO-F2 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -65 °C | |
| Output Current-Max | 0.1 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Power Dissipation-Max | 0.715 W | |
| Qualification Status | Not Qualified | |
| Reference Standard | IEC-60134 | |
| Rep Pk Reverse Voltage-Max | 35 V | |
| Surface Mount | YES | |
| Technology | PLANAR DOPED BARRIER | |
| Terminal Finish | TIN | |
| Terminal Form | FLAT | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 |