Datasheets
B500S by:
Diotec Semiconductor AG
Amphenol Corporation
Capax Technologies Inc
Crane Electronics
Cree, Inc.
Diotec Semiconductor AG
Fenghua (HK) Electronics Ltd
Galaxy Microelectronics
Galaxy Semi-Conductor Co Ltd
Infinite Electronics
Interpoint
Knowles Capacitors
Laser Components USA Inc
Luguang Electronic Technology Co Ltd
Merrimac Industries Inc
Murata Manufacturing Co Ltd
Nichia Corporation
North West Components Inc
Pico Electronics Inc
Pulse Electronics Corporation
Qorvo
RF Micro Devices Inc
ROHM Semiconductor
Roithner LaserTechnik GmbH
Same Sky
SEMIKRON
TE Connectivity
TE's AMP
Thomas & Betts
Vishay Intertechnologies
Yetda Industry Ltd
Not Found

Bridge Rectifier Diode, 1 Phase, 1A, 1000V V(RRM), Silicon, 8.30 X 6.40 MM, 2.50 MM HEIGHT, ROHS COMPLIANT, SURFACE MOUNT, PLASTIC, DIP-4

Part Details for B500S by Diotec Semiconductor AG

Results Overview of B500S by Diotec Semiconductor AG

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

B500S Information

B500S by Diotec Semiconductor AG is a Bridge Rectifier Diode.
Bridge Rectifier Diodes are under the broader part category of Diodes.

A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.

Price & Stock for B500S

Part # Distributor Description Stock Price Buy
ComSIT USA Electronic Component RoHS: Compliant Stock DE - 0
Stock ES - 2981
Stock US - 0
Stock MX - 0
Stock CN - 0
Stock HK - 0
RFQ

Part Details for B500S

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B500S Part Data Attributes

B500S Diotec Semiconductor AG
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B500S Diotec Semiconductor AG Bridge Rectifier Diode, 1 Phase, 1A, 1000V V(RRM), Silicon, 8.30 X 6.40 MM, 2.50 MM HEIGHT, ROHS COMPLIANT, SURFACE MOUNT, PLASTIC, DIP-4
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer DIOTEC SEMICONDUCTOR AG
Part Package Code DIP
Package Description DIP-4
Pin Count 4
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8541.10.00.80
Additional Feature UL RECOGNIZED
Configuration BRIDGE, 4 ELEMENTS
Diode Element Material SILICON
Diode Type BRIDGE RECTIFIER DIODE
Forward Voltage-Max (VF) 1.1 V
JESD-30 Code R-PDSO-G4
Moisture Sensitivity Level 1
Non-rep Pk Forward Current-Max 50 A
Number of Elements 4
Number of Phases 1
Number of Terminals 4
Operating Temperature-Max 150 °C
Operating Temperature-Min -50 °C
Output Current-Max 1 A
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Reference Standard UL RECOGNIZED
Rep Pk Reverse Voltage-Max 1000 V
Reverse Current-Max 5 µA
Reverse Recovery Time-Max 1.5 µs
Reverse Test Voltage 1000 V
Surface Mount YES
Terminal Form GULL WING
Terminal Position DUAL

Alternate Parts for B500S

This table gives cross-reference parts and alternative options found for B500S. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of B500S, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
DF10M-E3 Vishay Intertechnologies Check for Price Bridge Rectifier Diode, 1 Phase, 1A, 1000V V(RRM), Silicon, LEAD FREE, MINIATURE, PLASTIC, CASE DFM, 4 PIN B500S vs DF10M-E3
B380C1000W Micro Electronics Corporation Check for Price Bridge Rectifier Diode, 1 Phase, 1A, 900V V(RRM), Silicon, CASE R-6, 4 PIN B500S vs B380C1000W
B380C800W Micro Electronics Corporation Check for Price Bridge Rectifier Diode, 1 Phase, 1A, 900V V(RRM), Silicon, CASE R-6, 4 PIN B500S vs B380C800W

B500S Related Parts

B500S Frequently Asked Questions (FAQ)

  • A recommended PCB layout for optimal thermal performance of the B500S includes a large copper area on the top and bottom layers, connected to the thermal pad of the device. This helps to dissipate heat efficiently. Additionally, it's recommended to use thermal vias to connect the top and bottom layers, and to keep the PCB thickness as low as possible.

  • To ensure proper soldering of the B500S, use a soldering iron with a temperature of 250°C to 270°C. Apply a small amount of solder paste to the PCB pads, and place the device on the PCB. Use a reflow oven or a hot air gun to solder the device. Make sure to follow the recommended soldering profile and avoid overheating the device.

  • The maximum allowed voltage drop across the B500S is typically around 0.5V to 1V, depending on the specific application and operating conditions. Exceeding this voltage drop can lead to reduced efficiency, increased power losses, and potentially even damage to the device.

  • Yes, the B500S can be used in high-frequency switching applications, but it's essential to consider the device's switching characteristics, such as the turn-on and turn-off times, and the maximum allowed frequency. The device's datasheet provides information on the recommended operating frequency range and switching characteristics.

  • To protect the B500S from overvoltage and overcurrent conditions, use a suitable voltage regulator or overvoltage protection circuit, and consider adding a current sense resistor and a fuse or a current limiter to prevent excessive current. Additionally, ensure that the device is operated within its recommended operating conditions and follow proper PCB design and layout guidelines.