There are no models available for this part yet.
Overview of ATSAMA5D24B-CUR by Microchip Technology Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Aerospace and Defense
Agriculture Technology
Robotics and Drones
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| GC321AD7LP103KX18J | Murata Manufacturing Co Ltd | High Effective Capacitance & High Ripple Current Chip Multilayer Ceramic Capacitors for Automotive | |
| GC331AD7LQ153KX18J | Murata Manufacturing Co Ltd | High Effective Capacitance & High Ripple Current Chip Multilayer Ceramic Capacitors for Automotive | |
| GC331CD7LQ473KX19K | Murata Manufacturing Co Ltd | High Effective Capacitance & High Ripple Current Chip Multilayer Ceramic Capacitors for Automotive |
Price & Stock for ATSAMA5D24B-CUR by Microchip Technology Inc
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
| NAC | RoHS: Compliant Min Qty: 1 Package Multiple: 1 | 0 |
|
RFQ |
CAD Models for ATSAMA5D24B-CUR by Microchip Technology Inc
Part Data Attributes for ATSAMA5D24B-CUR by Microchip Technology Inc
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
MICROCHIP TECHNOLOGY INC
|
|
Package Description
|
TFBGA-256
|
|
Reach Compliance Code
|
compliant
|
|
Samacsys Manufacturer
|
Microchip
|
|
Address Bus Width
|
26
|
|
Bit Size
|
32
|
|
Boundary Scan
|
YES
|
|
Clock Frequency-Max
|
24 MHz
|
|
External Data Bus Width
|
32
|
|
Format
|
FLOATING POINT
|
|
Integrated Cache
|
YES
|
|
JESD-30 Code
|
S-PBGA-B256
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|
Length
|
8 mm
|
|
Low Power Mode
|
YES
|
|
Number of DMA Channels
|
32
|
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Number of External Interrupts
|
1
|
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Number of Serial I/Os
|
1
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Number of Terminals
|
256
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On Chip Data RAM Width
|
8
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Operating Temperature-Max
|
85 °C
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Operating Temperature-Min
|
-40 °C
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Package Body Material
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PLASTIC/EPOXY
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|
Package Code
|
TFBGA
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Package Equivalence Code
|
BGA256,18X18,16
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|
Package Shape
|
SQUARE
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|
Package Style
|
GRID ARRAY, THIN PROFILE, FINE PITCH
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|
RAM (words)
|
131072
|
|
Seated Height-Max
|
1.05 mm
|
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Speed
|
500 MHz
|
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Supply Voltage-Max
|
1.32 V
|
|
Supply Voltage-Min
|
1.1 V
|
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Supply Voltage-Nom
|
1.2 V
|
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Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
0.4 mm
|
|
Terminal Position
|
BOTTOM
|
|
Width
|
8 mm
|
|
uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR, RISC
|