Part Details for ATA5575M1330-DBQ by Microchip Technology Inc
Results Overview of ATA5575M1330-DBQ by Microchip Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
ATA5575M1330-DBQ Information
ATA5575M1330-DBQ by Microchip Technology Inc is an Other Signal Circuit.
Other Signal Circuits are under the broader part category of Signal Circuits.
A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.
Price & Stock for ATA5575M1330-DBQ
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
ATA5575M1330-DBQCT-ND
|
DigiKey | IC RFID TRANSP 100-150KHZ DIE Min Qty: 1 Lead time: 27 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) | Temporarily Out of Stock |
|
$0.2800 | Buy Now |
|
DISTI #
ATA5575M1330-DBQ
|
Microchip Technology Inc | 64/128bit RFID IDIC, 330pF, U-ID, BMP_DICE, Projected EOL: 2044-12-22 ECCN: EAR99 RoHS: Compliant Container: Reel |
0 Alternates Available |
|
$0.2500 / $0.3700 | Buy Now |
Part Details for ATA5575M1330-DBQ
ATA5575M1330-DBQ CAD Models
ATA5575M1330-DBQ Part Data Attributes
|
|
ATA5575M1330-DBQ
Microchip Technology Inc
Buy Now
Datasheet
|
Compare Parts:
ATA5575M1330-DBQ
Microchip Technology Inc
IC RFID 128BIT EE 330PF UID BUMP
Select a part to compare: |
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | DIE-2 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 27 Weeks | |
| Analog IC - Other Type | ANALOG CIRCUIT | |
| JESD-30 Code | R-XUUC-N2 | |
| Number of Channels | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIE | |
| Package Equivalence Code | DIE OR CHIP | |
| Package Shape | RECTANGULAR | |
| Package Style | UNCASED CHIP | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Position | UPPER | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |