Part Details for AT89LP213-20XI by Atmel Corporation
Overview of AT89LP213-20XI by Atmel Corporation
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Part Details for AT89LP213-20XI
AT89LP213-20XI CAD Models
AT89LP213-20XI Part Data Attributes
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AT89LP213-20XI
Atmel Corporation
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AT89LP213-20XI
Atmel Corporation
Microcontroller, 8-Bit, FLASH, 20MHz, CMOS, PDSO14, 4.40 MM, PLASTIC, MO-153AB-1, TSSOP-14
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ATMEL CORP | |
| Part Package Code | TSSOP | |
| Package Description | 4.40 MM, PLASTIC, MO-153AB-1, TSSOP-14 | |
| Pin Count | 14 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Core Architecture | 8051 | |
| Device Core | 8051 | |
| Clock Speed | 20 | |
| Ram | 0.125 | |
| Flash Memory | 2 | |
| Has ADC | NO | |
| Address Bus Width | ||
| Bit Size | 8 | |
| Clock Frequency-Max | 20 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| JESD-30 Code | R-PDSO-G14 | |
| JESD-609 Code | e0 | |
| Length | 5 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of I/O Lines | 12 | |
| Number of Terminals | 14 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 128 | |
| ROM (words) | 2048 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.2 mm | |
| Speed | 20 MHz | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 2.7 V | |
| Supply Voltage-Nom | 2.7 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Width | 4.4 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |