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Part Details for AT24C01C-MAPD-E by Microchip Technology Inc
Overview of AT24C01C-MAPD-E by Microchip Technology Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for AT24C01C-MAPD-E
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
AT24C01C-MAPD-E-ND
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DigiKey | IC EEPROM 1KBIT I2C 1MHZ 8UDFN Lead time: 7 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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Buy Now | |
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DISTI #
AT24C01C-MAPD-E
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Microchip Technology Inc | 2.5-5.5V, 1MHz, Auto Grade1, 8-UDFN, Projected EOL: 2044-12-22 RoHS: Compliant pbFree: Yes |
0 Alternates Available |
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$0.2400 / $0.2900 | Buy Now |
|
DISTI #
AT24C01C-MAPD-E
|
Avnet Silica | (Alt: AT24C01C-MAPD-E) RoHS: Compliant Min Qty: 15000 Package Multiple: 15000 Lead time: 9 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
Part Details for AT24C01C-MAPD-E
AT24C01C-MAPD-E CAD Models
AT24C01C-MAPD-E Part Data Attributes
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AT24C01C-MAPD-E
Microchip Technology Inc
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Datasheet
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AT24C01C-MAPD-E
Microchip Technology Inc
EEPROM, 128X8, Serial, CMOS, PDSO8
|
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | UDFN-8 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | Microchip | |
| Clock Frequency-Max (fCLK) | 0.4 MHz | |
| Data Retention Time-Min | 100 | |
| Endurance | 1000000 Write/Erase Cycles | |
| I2C Control Byte | 1010DDDR | |
| JESD-30 Code | R-PDSO-N8 | |
| JESD-609 Code | e4 | |
| Length | 3 mm | |
| Memory Density | 1024 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 128 words | |
| Number of Words Code | 128 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128X8 | |
| Output Characteristics | OPEN-DRAIN | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVSON | |
| Package Equivalence Code | SOLCC8,.12,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 5 V | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 0.6 mm | |
| Serial Bus Type | I2C | |
| Standby Current-Max | 0.000006 A | |
| Supply Current-Max | 0.003 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 2.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 2 mm | |
| Write Cycle Time-Max (tWC) | 5 ms | |
| Write Protection | HARDWARE |