Part Details for AS8E512K8CW-150/HQ by Micross Components
Overview of AS8E512K8CW-150/HQ by Micross Components
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (3 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for AS8E512K8CW-150/HQ
AS8E512K8CW-150/HQ CAD Models
AS8E512K8CW-150/HQ Part Data Attributes
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AS8E512K8CW-150/HQ
Micross Components
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Datasheet
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AS8E512K8CW-150/HQ
Micross Components
EEPROM Module, 512KX8, 150ns, Parallel, CMOS, PDIP32, DIP-32
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROSS COMPONENTS | |
| Part Package Code | DIP | |
| Package Description | DIP-32 | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 150 ns | |
| JESD-30 Code | R-PDIP-T32 | |
| Length | 42.418 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | EEPROM MODULE | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 512KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 5 V | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-PRF-38534 | |
| Seated Height-Max | 4.5974 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm | |
| Write Cycle Time-Max (tWC) | 10 ms |
Alternate Parts for AS8E512K8CW-150/HQ
This table gives cross-reference parts and alternative options found for AS8E512K8CW-150/HQ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AS8E512K8CW-150/HQ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
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| AS8E512K8CW-150/XT | EEPROM Module, 512KX8, 150ns, Parallel, CMOS, PDIP32, DIP-32 | Micross Components | AS8E512K8CW-150/HQ vs AS8E512K8CW-150/XT |
| 5962-9309101HYA | EEPROM Module, 512KX8, 150ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 | Mercury Systems Inc | AS8E512K8CW-150/HQ vs 5962-9309101HYA |
| AS8E512K8CW-150/IT | EEPROM Module, 512KX8, 150ns, Parallel, CMOS, PDIP32, DIP-32 | Micross Components | AS8E512K8CW-150/HQ vs AS8E512K8CW-150/IT |
| 5962-9309101HYC | EEPROM Module, 512KX8, 150ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 | Mercury Systems Inc | AS8E512K8CW-150/HQ vs 5962-9309101HYC |
| 5962-9309101HYC | EEPROM Module, 512KX8, 150ns, Parallel, CMOS, CDIP32, DUAL CAVITY, SIDE BRAZED, HERMETIC SEALED, CERAMIC, DIP-32 | Microsemi Corporation | AS8E512K8CW-150/HQ vs 5962-9309101HYC |