Datasheets
AS6C2008-55BIN by: Alliance Memory Inc

Standard SRAM, 256KX8, 55ns, CMOS, PBGA36, 6 X 8 MM, ROHS COMPLIANT, TFBGA-36

Part Details for AS6C2008-55BIN by Alliance Memory Inc

Overview of AS6C2008-55BIN by Alliance Memory Inc

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Price & Stock for AS6C2008-55BIN

Part # Distributor Description Stock Price Buy
DISTI # 85AK7229
Newark Lp Sram, 2Mb, 256K X 8, 3V, 36Pin Tfbga (6 X 8Mm), 55Ns, Industrial Temp |Alliance Memory AS6C2008-55BIN RoHS: Not Compliant Min Qty: 480 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 1 $3.9000
  • 5,000 $3.7000
$3.7000 / $3.9000 Buy Now
DISTI # 1450-1171-ND
DigiKey IC SRAM 2MBIT PARALLEL 36TFBGA Min Qty: 480 Lead time: 16 Weeks Container: Tray Temporarily Out of Stock
  • 480 $3.0686
$3.0686 Buy Now
DISTI # AS6C2008-55BIN
Avnet Americas SRAM Chip Async Single 3V 2M-Bit 256K x 8 55ns 36-Pin TF-BGA - Trays (Alt: AS6C2008-55BIN) RoHS: Compliant Min Qty: 480 Package Multiple: 480 Lead time: 16 Weeks, 0 Days Container: Tray 1705 Factory Stock
  • 480 $3.0469
  • 960 $2.9835
  • 1,920 $2.9055
  • 2,880 $2.7690
  • 3,840 $2.6910
$2.6910 / $3.0469 Buy Now
DISTI # 913-AS6C2008-55BIN
Mouser Electronics SRAM LP SRAM, 2Mb, 256K x 8, 3V, 36pin TFBGA (6 x 8mm), 55ns, Industrial Temp - Tray RoHS: Compliant 0
  • 480 $3.0100
  • 960 $2.9500
$2.9500 / $3.0100 Order Now
Future Electronics   RoHS: Compliant pbFree: Yes Min Qty: 480 Package Multiple: 480 Lead time: 16 Weeks Container: Tray 0
Tray
  • 480 $2.4400
$2.4400 Buy Now
Karl Kruse GmbH & Co KG LP SRAM 2Mb 256K x 8 3V 36pin TFBGA (6 x 8mm) 55ns Industrial Temp 56
RFQ
DISTI # AS6C2008-55BIN
Avnet Silica SRAM Chip Async Single 3V 2M-Bit 256K x 8 55ns 36-Pin TF-BGA (Alt: AS6C2008-55BIN) RoHS: Compliant Min Qty: 480 Package Multiple: 480 Lead time: 17 Weeks, 0 Days Silica - 480
Buy Now
New Advantage Corporation   RoHS: Compliant Min Qty: 1 Package Multiple: 480 480
  • 480 $3.8800
$3.8800 Buy Now

Part Details for AS6C2008-55BIN

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AS6C2008-55BIN Part Data Attributes

AS6C2008-55BIN Alliance Memory Inc
Buy Now Datasheet
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AS6C2008-55BIN Alliance Memory Inc Standard SRAM, 256KX8, 55ns, CMOS, PBGA36, 6 X 8 MM, ROHS COMPLIANT, TFBGA-36
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ALLIANCE MEMORY INC
Part Package Code BGA
Pin Count 36
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Factory Lead Time 16 Weeks
Samacsys Manufacturer Alliance Memory
Access Time-Max 55 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B36
Length 8 mm
Memory Density 2097152 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 36
Number of Words 262144 words
Number of Words Code 256000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 256KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA36,6X8,30
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Standby Current-Max 0.00001 A
Standby Voltage-Min 1.5 V
Supply Current-Max 0.035 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.75 mm
Terminal Position BOTTOM
Width 6 mm

Alternate Parts for AS6C2008-55BIN

This table gives cross-reference parts and alternative options found for AS6C2008-55BIN. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AS6C2008-55BIN, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
IS62UR2568LL-55HI Standard SRAM, 256KX8, 55ns, CMOS, PDSO32, STSOP1-32 Integrated Silicon Solution Inc AS6C2008-55BIN vs IS62UR2568LL-55HI
V62C3802096L-55TI Standard SRAM, 256KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32 Mosel Vitelic Corporation AS6C2008-55BIN vs V62C3802096L-55TI
V62C2802096L-55TI Standard SRAM, 256KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32 Mosel Vitelic Corporation AS6C2008-55BIN vs V62C2802096L-55TI
IS62WV2568BLL-55TI Standard SRAM, 256KX8, 55ns, CMOS, PDSO32, 8 X 13.40 MM, MO-183, TSOP1-32 ABLIC Inc. AS6C2008-55BIN vs IS62WV2568BLL-55TI
V62C2182048L-55T Standard SRAM, 256KX8, 55ns, CMOS, PDSO32, TSOP-32 Mosel Vitelic Corporation AS6C2008-55BIN vs V62C2182048L-55T
V62C2802048LL-55T Standard SRAM, 256KX8, 55ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, TSOP1-32 Mosel Vitelic Corporation AS6C2008-55BIN vs V62C2802048LL-55T
IS62US2568LL-55BI Standard SRAM, 256KX8, 55ns, CMOS, PBGA36, MINI, BGA-36 Integrated Silicon Solution Inc AS6C2008-55BIN vs IS62US2568LL-55BI
V62C3802096L-55B Standard SRAM, 256KX8, 55ns, CMOS, PBGA48, 9 X 12 MM, CSP, FBGA-48 Mosel Vitelic Corporation AS6C2008-55BIN vs V62C3802096L-55B
IS62WV2568BLL-55TLI Standard SRAM, 256KX8, 55ns, CMOS, PDSO32, 8 X 13.40 MM, LEAD FREE, MO-183, TSOP1-32 ABLIC Inc. AS6C2008-55BIN vs IS62WV2568BLL-55TLI
HY62UF8200ASLM-55I Standard SRAM, 256KX8, 55ns, CMOS, PBGA48, MICRO, CSP, BGA-48 SK Hynix Inc AS6C2008-55BIN vs HY62UF8200ASLM-55I

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