Part Details for AS4C64M16D3LC-12BIN by Alliance Memory Inc
Overview of AS4C64M16D3LC-12BIN by Alliance Memory Inc
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Consumer Electronics
Education and Research
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for AS4C64M16D3LC-12BIN
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
82AK3826
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Newark | Dram, 1Gbit, 800Mhz, Fbga-96, Dram Type:Ddr3, Memory Configuration:64M X 16Bit, Clock Frequency Max:800Mhz, Ic Case/Package:Fbga, No. Of Pins:96Pins, Supply Voltage Nom:1.35V, Ic Mounting:Surface Mount, Product Range:- Rohs Compliant: Yes |Alliance Memory AS4C64M16D3LC-12BIN Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 198 |
|
$5.4200 / $8.2900 | Buy Now |
DISTI #
1450-AS4C64M16D3LC-12BIN-ND
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DigiKey | IC DRAM 1GBIT PARALLEL 96FBGA Min Qty: 1 Lead time: 6 Weeks Container: Tray |
206 In Stock |
|
$4.6860 / $6.5700 | Buy Now |
DISTI #
AS4C64M16D3LC-12BI
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Avnet Americas | - Trays (Alt: AS4C64M16D3LC-12BI) RoHS: Not Compliant Min Qty: 198 Package Multiple: 198 Lead time: 6 Weeks, 0 Days Container: Tray | 3241 Factory Stock |
|
$5.6700 | Buy Now |
DISTI #
913-4C64M16D3LC12BIN
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Mouser Electronics | DRAM DDR3, 1G, 64M X 16, 1.35V, 96-BALL FBGA, 800MHZ, INDUSTRIAL TEMP RoHS: Compliant | 518 |
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$4.6000 / $6.4700 | Buy Now |
|
Future Electronics | DDR3 1G-C DIE 64M x 16 1.35V ITEMP (-40 95C) 96-ball FBGA RoHS: Compliant pbFree: Yes Min Qty: 47 Package Multiple: 1980 Lead time: 6 Weeks Container: Tray | 47Tray |
|
$4.5100 | Buy Now |
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Karl Kruse GmbH & Co KG | DDR3 1G 64M X 16 1.35V 96-BALL FBGA 800MHZ INDUSTRIAL TEMP | 3241 |
|
RFQ | |
DISTI #
AS4C64M16D3LC-12BIN
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Avnet Silica | DRAM Chip DDR3L SDRAM 1Gbit 64M X 16 1.35V 96-Pin FBGA Tray (Alt: AS4C64M16D3LC-12BIN) RoHS: Compliant Min Qty: 198 Package Multiple: 198 Lead time: 7 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
Part Details for AS4C64M16D3LC-12BIN
AS4C64M16D3LC-12BIN CAD Models
AS4C64M16D3LC-12BIN Part Data Attributes
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AS4C64M16D3LC-12BIN
Alliance Memory Inc
Buy Now
Datasheet
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Compare Parts:
AS4C64M16D3LC-12BIN
Alliance Memory Inc
DDR3L DRAM, 64MX16, 0.225ns, CMOS, PBGA78, FBGA-96
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ALLIANCE MEMORY INC | |
Package Description | FBGA-96 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.32 | |
Factory Lead Time | 6 Weeks | |
Samacsys Manufacturer | Alliance Memory | |
Access Mode | MULTI BANK PAGE BURST | |
Access Time-Max | 0.225 ns | |
Additional Feature | AUTO/SELF REFRESH | |
Clock Frequency-Max (fCLK) | 800 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 4,8 | |
JESD-30 Code | R-PBGA-B96 | |
Length | 13 mm | |
Memory Density | 1073741824 bit | |
Memory IC Type | DDR3L DRAM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 78 | |
Number of Words | 67108864 words | |
Number of Words Code | 64000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 95 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 64MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA78,9X16,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Refresh Cycles | 8192 | |
Seated Height-Max | 1 mm | |
Self Refresh | YES | |
Sequential Burst Length | 4,8 | |
Standby Current-Max | 0.015 A | |
Supply Current-Max | 0.195 mA | |
Supply Voltage-Max (Vsup) | 1.45 V | |
Supply Voltage-Min (Vsup) | 1.283 V | |
Supply Voltage-Nom (Vsup) | 1.35 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 7.5 mm |