Part Details for AS4C64M16D3LC-12BCN by Alliance Memory Inc
Overview of AS4C64M16D3LC-12BCN by Alliance Memory Inc
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Consumer Electronics
Education and Research
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for AS4C64M16D3LC-12BCN
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
85AK7100
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Newark | Ddr3, 1G, 64M X 16, 1.35V, 96-Ball Fbga, 800Mhz, Commercial Temp |Alliance Memory AS4C64M16D3LC-12BCN Min Qty: 198 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$5.0000 / $5.3000 | Buy Now |
DISTI #
1450-AS4C64M16D3LC-12BCN-ND
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DigiKey | IC DRAM 1GBIT PARALLEL 96FBGA Min Qty: 1 Lead time: 6 Weeks Container: Tray |
198 In Stock |
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$3.9422 / $5.5300 | Buy Now |
DISTI #
AS4C64M16D3LC-12BC
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Avnet Americas | DRAM Chip DDR3L SDRAM 1Gbit 64M X 16 1.35V 96-Pin FBGA Tray - Trays (Alt: AS4C64M16D3LC-12BC) RoHS: Not Compliant Min Qty: 198 Package Multiple: 198 Lead time: 6 Weeks, 0 Days Container: Tray | 54368 Factory Stock |
|
$4.7700 | Buy Now |
DISTI #
913-4C64M16D3LC12BCN
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Mouser Electronics | DRAM DDR3, 1G, 64M X 16, 1.35V, 96-BALL FBGA, 800MHZ, (C-die), COMMERCIAL TEMP - Tray RoHS: Compliant | 594 |
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$3.8700 / $5.4500 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 198 Package Multiple: 198 Lead time: 6 Weeks Container: Tray | 0Tray |
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$3.3200 | Buy Now |
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Karl Kruse GmbH & Co KG | DDR3 1G 64M X 16 1.35V 96-BALL FBGA 800MHZ COMMERCIAL TEMP | 54368 |
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RFQ |
Part Details for AS4C64M16D3LC-12BCN
AS4C64M16D3LC-12BCN CAD Models
AS4C64M16D3LC-12BCN Part Data Attributes
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AS4C64M16D3LC-12BCN
Alliance Memory Inc
Buy Now
Datasheet
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Compare Parts:
AS4C64M16D3LC-12BCN
Alliance Memory Inc
DDR3L DRAM, 64MX16, 0.225ns, CMOS, PBGA78, FBGA-96
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ALLIANCE MEMORY INC | |
Package Description | FBGA-96 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.32 | |
Factory Lead Time | 6 Weeks | |
Samacsys Manufacturer | Alliance Memory | |
Access Mode | MULTI BANK PAGE BURST | |
Access Time-Max | 0.225 ns | |
Additional Feature | AUTO/SELF REFRESH | |
Clock Frequency-Max (fCLK) | 800 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 4,8 | |
JESD-30 Code | R-PBGA-B96 | |
Length | 13 mm | |
Memory Density | 1073741824 bit | |
Memory IC Type | DDR3L DRAM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 78 | |
Number of Words | 67108864 words | |
Number of Words Code | 64000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 95 °C | |
Operating Temperature-Min | ||
Organization | 64MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA78,9X16,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Refresh Cycles | 8192 | |
Seated Height-Max | 1 mm | |
Self Refresh | YES | |
Sequential Burst Length | 4,8 | |
Standby Current-Max | 0.015 A | |
Supply Current-Max | 0.195 mA | |
Supply Voltage-Max (Vsup) | 1.45 V | |
Supply Voltage-Min (Vsup) | 1.283 V | |
Supply Voltage-Nom (Vsup) | 1.35 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 7.5 mm |