Part Details for AS4C64M16D3LB-12BIN by Alliance Memory Inc
Overview of AS4C64M16D3LB-12BIN by Alliance Memory Inc
- Distributor Offerings: (11 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Consumer Electronics
Education and Research
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for AS4C64M16D3LB-12BIN
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
82AK3825
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Newark | Dram, 1Gbit, 800Mhz, Fbga-96, Dram Type:Ddr3, Memory Configuration:64M X 16Bit, Clock Frequency Max:800Mhz, Ic Case/Package:Fbga, No. Of Pins:96Pins, Supply Voltage Nom:1.35V, Ic Mounting:Surface Mount, Product Range:- Rohs Compliant: Yes |Alliance Memory AS4C64M16D3LB-12BIN Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 190 |
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$6.2800 / $9.6000 | Buy Now |
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DISTI #
1450-1483-ND
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DigiKey | IC DRAM 1GBIT PARALLEL 96FBGA Min Qty: 1 Lead time: 8 Weeks Container: Tray |
374 In Stock |
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$5.2552 / $7.3300 | Buy Now |
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DISTI #
AS4C64M16D3LB-12BI
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Avnet Americas | DRAM Chip DDR3L SDRAM 1G-Bit 64M x 16 1.35V 96-Pin FBGA Tray - Trays (Alt: AS4C64M16D3LB-12BI) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 8 Weeks, 0 Days Container: Tray | 1201159 Factory Stock |
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$4.0533 / $4.2942 | Buy Now |
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DISTI #
913-A4C6416D3LB12BIN
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Mouser Electronics | DRAM DDR3, 1G, 64M X 16, 1.35V, 96-BALL FBGA, 800MHZ, (B-die), INDUSTRIAL TEMP - Tray RoHS: Compliant | 2033 |
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$4.5600 / $6.1700 | Buy Now |
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Future Electronics | AS4C64M16D3LB: 1 Gb (64 M x 16) 800 MHz 20 ns Surface Mount SDRAM - FBGA-96 RoHS: Compliant pbFree: Yes Min Qty: 190 Package Multiple: 190 Lead time: 8 Weeks Container: Tray | 0Tray |
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$4.1800 | Buy Now |
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DISTI #
AS4C64M16D3LB-12BI
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TME | IC: DRAM memory, 1GbDRAM, 64Mx16bit, 1.35V, 800MHz, 13.75ns, FBGA96 Min Qty: 1 | 0 |
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$5.0000 / $8.1800 | RFQ |
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Karl Kruse GmbH & Co KG | DDR3 1G 64M X 16 1.35V 96-BALL FBGA 800MHZ INDUSTRIAL TEMP | 9355 |
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RFQ | |
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DISTI #
AS4C64M16D3LB-12BIN
|
Avnet Asia | DRAM Chip DDR3L SDRAM 1G-Bit 64M x 16 1.35V 96-Pin FBGA Tray (Alt: AS4C64M16D3LB-12BIN) RoHS: Compliant Min Qty: 190 Package Multiple: 190 Lead time: 8 Weeks, 0 Days | 0 |
|
RFQ | |
|
DISTI #
AS4C64M16D3LB-12BIN
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Avnet Silica | DRAM Chip DDR3L SDRAM 1G-Bit 64M x 16 1.35V 96-Pin FBGA Tray (Alt: AS4C64M16D3LB-12BIN) RoHS: Compliant Min Qty: 190 Package Multiple: 190 Lead time: 9 Weeks, 0 Days | Silica - 1900 |
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Buy Now | |
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Chip1Cloud | DDR3-1600 64Mx16 (1Gb) Ind | 1983 |
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RFQ |
Part Details for AS4C64M16D3LB-12BIN
AS4C64M16D3LB-12BIN CAD Models
AS4C64M16D3LB-12BIN Part Data Attributes
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AS4C64M16D3LB-12BIN
Alliance Memory Inc
Buy Now
Datasheet
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Compare Parts:
AS4C64M16D3LB-12BIN
Alliance Memory Inc
DDR DRAM, 64MX16, CMOS, PBGA96, FBGA-96
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ALLIANCE MEMORY INC | |
| Package Description | FBGA-96 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Factory Lead Time | 8 Weeks | |
| Samacsys Manufacturer | Alliance Memory | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH | |
| JESD-30 Code | R-PBGA-B96 | |
| Length | 13 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | DDR3L DRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.45 V | |
| Supply Voltage-Min (Vsup) | 1.283 V | |
| Supply Voltage-Nom (Vsup) | 1.35 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 9 mm |