Part Details for AS4C64M16D3L-12BCN by Alliance Memory Inc
Overview of AS4C64M16D3L-12BCN by Alliance Memory Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Consumer Electronics
Education and Research
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for AS4C64M16D3L-12BCN
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
1450-1113-ND
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DigiKey | IC DRAM 1GBIT PARALLEL 96FBGA Lead time: 8 Weeks Container: Tray | Limited Supply - Call |
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Buy Now | |
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Bristol Electronics | 114 |
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RFQ |
Part Details for AS4C64M16D3L-12BCN
AS4C64M16D3L-12BCN CAD Models
AS4C64M16D3L-12BCN Part Data Attributes
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AS4C64M16D3L-12BCN
Alliance Memory Inc
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Datasheet
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AS4C64M16D3L-12BCN
Alliance Memory Inc
DDR DRAM, 64MX16, CMOS, PBGA96, 9 X 13 MM, 1.20 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ALLIANCE MEMORY INC | |
Package Description | 9 X 13 MM, 1.20 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, FBGA-96 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.32 | |
Access Mode | MULTI BANK PAGE BURST | |
Additional Feature | AUTO/SELF REFRESH | |
JESD-30 Code | R-PBGA-B96 | |
Length | 13 mm | |
Memory Density | 1073741824 bit | |
Memory IC Type | DDR DRAM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 96 | |
Number of Words | 67108864 words | |
Number of Words Code | 64000000 | |
Operating Mode | SYNCHRONOUS | |
Organization | 64MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Supply Voltage-Max (Vsup) | 1.45 V | |
Supply Voltage-Min (Vsup) | 1.283 V | |
Supply Voltage-Nom (Vsup) | 1.35 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 9 mm |