Datasheets
AS4C512M16D3LB-12BIN by: Alliance Memory Inc

DDR DRAM Module,

Part Details for AS4C512M16D3LB-12BIN by Alliance Memory Inc

Overview of AS4C512M16D3LB-12BIN by Alliance Memory Inc

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Price & Stock for AS4C512M16D3LB-12BIN

Part # Distributor Description Stock Price Buy
DISTI # 82AK3817
Newark Dram, 800Mhz, 8Gbit, Fbga-96, Dram Type:Ddr3L, Memory Configuration:512M X 16Bit, Clock Frequency Max:800Mhz, Ic Case/Package:Fbga, No. Of Pins:96Pins, Supply Voltage Nom:1.35V, Ic Mounting:Surface Mount, Product Range:- Rohs Compliant: Yes |Alliance Memory AS4C512M16D3LB-12BIN Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk 180
  • 1 $37.6300
  • 25 $34.4800
  • 50 $32.0300
  • 100 $30.9800
  • 250 $29.9300
$29.9300 / $37.6300 Buy Now
DISTI # 1450-AS4C512M16D3LB-12BIN-ND
DigiKey IC DRAM 8GBIT PARALLEL 96FBGA Min Qty: 1 Lead time: 4 Weeks Container: Tray 167
In Stock
  • 1 $32.3500
  • 10 $30.4210
  • 25 $29.3652
  • 40 $28.4365
  • 180 $25.0322
  • 360 $24.3586
$24.3586 / $32.3500 Buy Now
DISTI # AS4C512M16D3LB-12B
Avnet Americas DRAM Chip DDR3L SDRAM 8G-bit 512M X 16 96-Pin FBGA Tray - Trays (Alt: AS4C512M16D3LB-12B) Min Qty: 180 Package Multiple: 180 Lead time: 4 Weeks, 0 Days Container: Tray 26561 Factory Stock
  • 180 $27.3438
  • 360 $26.7750
  • 720 $26.0750
  • 1,080 $24.8500
  • 1,440 $24.1500
  • 1,800 $23.4500
  • 18,000 $22.3600
$22.3600 / $27.3438 Buy Now
DISTI # 913-4C51216D3LB12BIN
Mouser Electronics DRAM DDR3L, 8G, 512M X 16, 1.35V, 96-BALL FBGA, 800MHZ INDUSTRIAL TEMP (MT41K512M16HA-125IT:A) RoHS: Compliant 1103
  • 1 $30.5900
  • 10 $28.9100
  • 25 $27.3900
  • 50 $27.2200
  • 100 $26.8800
  • 180 $23.8800
$23.8800 / $30.5900 Buy Now
Future Electronics DRAM 8G, DDR3L, 512M X 16, 1.35V, 96-BALL FBGA, -40 C to 95 C RoHS: Compliant pbFree: Yes Min Qty: 180 Package Multiple: 180 Lead time: 4 Weeks Container: Tray 0
Tray
  • 180 $23.4200
$23.4200 Buy Now
Karl Kruse GmbH & Co KG DDR3L 8G 512M X 16 1.35V 96-BALL FBGA 800MHZ INDUSTRIAL TEMP (MT41K512M16HA-125IT:A) 25576
RFQ
DISTI # AS4C512M16D3LB-12BIN
Avnet Asia DRAM Chip DDR3L SDRAM 8G-bit 512M X 16 96-Pin FBGA Tray (Alt: AS4C512M16D3LB-12BIN) RoHS: Compliant Min Qty: 180 Package Multiple: 180 Lead time: 4 Weeks, 0 Days 0
RFQ
DISTI # AS4C512M16D3LB-12BIN
Avnet Silica DRAM Chip DDR3L SDRAM 8G-bit 512M X 16 96-Pin FBGA Tray (Alt: AS4C512M16D3LB-12BIN) RoHS: Compliant Min Qty: 180 Package Multiple: 180 Lead time: 5 Weeks, 0 Days Silica - 2520
Buy Now
New Advantage Corporation INDUSTRIAL (-40 ~ 95�C)/ RoHS: Compliant Min Qty: 1 Package Multiple: 180 1884
  • 180 $36.4300
  • 1,884 $33.7100
$33.7100 / $36.4300 Buy Now

Part Details for AS4C512M16D3LB-12BIN

AS4C512M16D3LB-12BIN CAD Models

AS4C512M16D3LB-12BIN Part Data Attributes

AS4C512M16D3LB-12BIN Alliance Memory Inc
Buy Now Datasheet
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AS4C512M16D3LB-12BIN Alliance Memory Inc DDR DRAM Module,
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer ALLIANCE MEMORY INC
Package Description FBGA-96
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.36
Factory Lead Time 4 Weeks
Date Of Intro 2019-05-24
Samacsys Manufacturer Alliance Memory
Access Mode MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH, ALSO OPERATES AT 1.5V SUPPLY
Clock Frequency-Max (fCLK) 800 MHz
I/O Type COMMON
Interleaved Burst Length 8
JESD-30 Code R-PBGA-B96
Length 13.5 mm
Memory Density 8589934592 bit
Memory IC Type DDR3L DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 96
Number of Words 536870912 words
Number of Words Code 512000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 95 °C
Operating Temperature-Min -40 °C
Organization 512MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA96,9X16,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Refresh Cycles 8192
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 8
Standby Current-Max 0.06 A
Supply Current-Max 0.47 mA
Supply Voltage-Max (Vsup) 1.45 V
Supply Voltage-Min (Vsup) 1.283 V
Supply Voltage-Nom (Vsup) 1.35 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 9 mm

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