Part Details for AS4C32M16D2C-25BIN by Alliance Memory Inc
Overview of AS4C32M16D2C-25BIN by Alliance Memory Inc
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for AS4C32M16D2C-25BIN
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
85AK6969
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Newark | Ddr2, 512Mb, 32M X 16, 1.8V, 84-Ball Bga, 400 Mhz, Industrial Temp |Alliance Memory AS4C32M16D2C-25BIN Min Qty: 209 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$3.4000 / $3.6000 | Buy Now |
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DISTI #
1450-AS4C32M16D2C-25BIN-ND
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DigiKey | IC DRAM 512MBIT SSTL 18 84FBGA Min Qty: 1 Lead time: 6 Weeks Container: Tray |
209 In Stock |
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$2.8163 / $3.9000 | Buy Now |
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DISTI #
AS4C32M16D2C-25BIN
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Avnet Americas | - Trays (Alt: AS4C32M16D2C-25BIN) RoHS: Not Compliant Min Qty: 209 Package Multiple: 209 Lead time: 6 Weeks, 0 Days Container: Tray | 159666 Factory Stock |
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$3.2400 | Buy Now |
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DISTI #
AS4C32M16D2C-25BIN
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Avnet Americas | - Tape and Reel (Alt: AS4C32M16D2C-25BIN) Min Qty: 2500 Package Multiple: 2500 Lead time: 6 Weeks, 0 Days Container: Reel | 0 |
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$3.3300 | Buy Now |
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DISTI #
913-S4C32M16D2C25BIN
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Mouser Electronics | DRAM DDR2, 512Mb, 32M x 16, 1.8V, 84-ball BGA, 400 MHz, Industrial Temp - Tray RoHS: Compliant | 292 |
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$2.6500 / $3.7900 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 209 Package Multiple: 209 Lead time: 6 Weeks Container: Tray | 0Tray |
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$2.2500 | Buy Now |
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Karl Kruse GmbH & Co KG | DDR2 512Mb 32M x 16 1.8V 84-ball BGA 400 MHz Industrial Temp | 159686 |
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RFQ | |
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DISTI #
AS4C32M16D2C-25BIN
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Avnet Silica | DRAM Chip DDR2 SDRAM 512Mbit 32M X 16 1.8V 84-Pin FBGA Tray (Alt: AS4C32M16D2C-25BIN) RoHS: Compliant Min Qty: 209 Package Multiple: 209 Lead time: 11 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for AS4C32M16D2C-25BIN
AS4C32M16D2C-25BIN CAD Models
AS4C32M16D2C-25BIN Part Data Attributes
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AS4C32M16D2C-25BIN
Alliance Memory Inc
Buy Now
Datasheet
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Compare Parts:
AS4C32M16D2C-25BIN
Alliance Memory Inc
DDR2 DRAM, 32MX16, 0.4ns, CMOS, PBGA84, FBGA-84
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ALLIANCE MEMORY INC | |
| Package Description | FBGA-84 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.28 | |
| Factory Lead Time | 6 Weeks | |
| Access Mode | FOUR BANK PAGE BURST | |
| Access Time-Max | 0.4 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 400 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B84 | |
| Length | 12.5 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | DDR2 DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 84 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA84,9X15,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.01 A | |
| Supply Current-Max | 0.17 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm |